eMMCs have many application areas in various consumer and industrial electronics. For example, you can apply eMMc in handheld computers, mobile phones, routers, navigational systems, et cetera. These devices act as a host processor assistant, but only in terms of memory. They help the central processor (host processor) manage the low-level flash memory. In doing so, they boost the processor’s performance, which in turn yields impeccable outputs. However, to attach eMMCs onto PCBs, manufacturers have to utilize a method that ensures:
- Stability,
- Efficiency, and
- Durability.
And that is where BGA comes in. So what does eMMC BGA entail? And why is it crucial to undertake?
All about BGA and why it is important
BGA stands for Ball Grid Array. It is an SMT (surface mount tech) method that manufacturers utilize to package ICs. Ball Grid Array features multiple overlapping layers which contain up to a million flip-flops, logic gates, multiplexes, or/and other circuits.
Manufacturers package various BGA components into different standardized packages electronically. These packages feature an extensive array of sizes and shapes. They also feature effective density, impeccable inductance, and a high lead count.
Ball Grid Arrays packages let you make high-density IC (Integrated Circuit) connections easily. They do so by letting you utilize the bottom side of any chip package to make connections.
BGA has grown in terms of popularity over time. Manufacturers utilize this method extensively for SMD Integrated Circuits that need multiple connections. Manufacturers use bottom side of an IC package instead of making numerous connections around the IC’s edges. Thus, they can reduce the connection density that falls upon the IC. In doing so, they simplify the PCB layout, which makes the Print Circuit Board more efficient.
BGA’s Main Problem
After connecting various components onto a PCB via BGA, you will likely face one major problem. That problem is accessing the component-to-PCB connection. This is because one achieves the connection using the bottom part of the BGA component, which faces the PCB. Thus, accessing the connection becomes utterly impossible without altering the connection itself.
Due to this issue, manufacturers have a hard time inspecting, soldering, and de-soldering BGA components. But it only makes it hard, not impossible.
In mainline Print Circuit Board production, this is not a big issue to overcome. Manufacturers in this field easily:
- Inspect solder and
- De-solder BGA components using special machinery and skills.
By doing so, they improve the overall performance and reliability of BGA, making it more efficient to use.
eMMC, what does it entail?
eMMC refers to an embedded multi-media card. You can find these gadgets in different electronic devices such as:
- Wearable device
- Smartphones and,
- Tablets
eMMCs offer a low-cost, small form storage solution for various electronic components. It is hence pretty popular in the modern world.
When you compare eMMCs to other storage devices, you will note one significant difference. Unlike other storage devices, eMMC connects directly onto the motherboard.
eMMCs feature a Ball Grid Array (BGA) package. To install this package onto your PCB, you have to utilize this package during the SMT production phase of the Board.
Utilizing this package, you can efficiently mount your eMMC onto a PCB incurring a minimal cost.
eMMC BGA installation causes challenges to the process of upgrading storage. However, using proper tools, skills, and equipment makes it possible to re-solder and de-solder BGA packages.
eMMC BGA process, how does it take place?
When BGA components hit the market, two issues arose:
- Was their sufficient solderability
- Was BGA soldering reliable compared to the traditional soldering types
After a couple of tests, the results were remarkable. The BGA soldering process was super-reliable and even more efficient than the QFP soldering process.
Due to this efficiency and reliability, the BGA process has become pretty popular over time. It now has extensive applications in the mass production of PCBs and the development of prototype PCBs. The results are always impeccable.
For a perfect BGA solder, you should utilize the reflow technique to manipulate the assembly temperature. Using this technique, you can adjust the assembly temperature to melt the solder underneath various BGA components. If you utilize the perfect heat range, then the results will be incredible. However, setting the wrong temperature range might lead to a bond that is not stable which is not good.
For the BGA soldering process to occur, the soldiering balls found on the bottom part of eMMC need to have a controlled solder amount.
After attaching the eMMC onto its specific PCB position, all that is left is heating up the solder to create a bond. In the soldering process, healing occurs, and the BGA component (in this case, an eMMC) attaches to the PCB. The eMMC is held in place by the molten solder’s surface tension as the hot solder cools off and solidifies, creating a bond.
You should wisely choose the soldering temperature and the solder alloy composition to avoid melting the solder to liquid form. Instead, the solder should melt up to a semi-liquid state. When the solder alloy is in this form, neighboring eMMC BGA balls stay apart, which is essential.
Benefits of utilizing the emmc BGA process
If you are looking to utilize the emmc BGA process, then here are some benefits that you are likely to reap:
An improved print circuit board design
The emmc BGA process yields lower density tracks which let you develop improved print circuit board designs.
Robustness
Flat quad packages bear packages that have fine pins which are prone to damage under slight mishandling. And when damaged, repairing these packages is also almost close to impossible. On the other hand, emmc BGA packages are not prone to damage. Actually, their design makes them pretty hard to damage even under high levels of mishandling.
In case of damage, unlike FQP packages, you can repair emmc BGA packages easily.
Impeccable thermal resistance
eMMC BGA packages have a pretty low thermal resistance value which lets them conduct heat efficiently. Therefore, when eMMC BGA packages are under use, they rarely overheat, making them more efficient and reliable.
High speed
Since you can locate conductors on the bottom part of the eMMC BGA, that dictates that the various leads found within the eMMC BGA are short. Due to these short leads, these gadgets perform better than traditional Quad Flat Packages that have longer leads.
Conclusion
eMMC BGA has become pretty popular over time. Their debut in the market had some uncertainties. However, after a few tests, this gadget has proven pretty efficient. Hence if you are looking to boost your tablet’s or smartphone’s speed. Swapping traditional eMMCs with eMMC BGAs is not a bad idea.
