It is a widely used substrate substance in the production of PCBs and can be coated or uncoated. It is popular in the industry due to its cost-effectiveness and reliability.
FR-4 comprises a mineral filler, glass cloth & epoxy resin that laminates together. A Glass cloth gives mechanical strength and electrical insulation, while an epoxy resin offers chemical resistance & excellent thermal properties.
Due to its mechanical properties and cost-effectiveness, the fiberglass-reinforced epoxy composite is widely used as a substrate substance for printed boards. Furthermore, its good dielectric properties make it a suitable coating for PCBs.
Understand the Fr4 density PCB Industry.
Compared to epoxy glass/polyimide, which has a resin of thirty percent, FR-4 has a lower polish of twenty percent. These results in a lower dielectric constant, giving FR-4 superior signal transmission qualities compared to others.
FR4 is the popular choice among engineers due to its superior signal transmission qualities. This makes a sheet of FR-4 material. A widely used, cost-effective material for constructing electronic device cabinets such as computer racks. Additionally, it is commonly employed in building metal cases for electric equipment like power supplies & motor controllers for industrial actuators or motors.
Is Fr4 density the way to go?
FR4 has several advantages, such as its affordability, lightweight nature, and ability to provide electrical & mechanical stability. Additionally, FR4 is available in a variety of thicknesses. However, it may not be the optimal board substance for all appliances. For instance, when constructing a radio, it may be more appropriate to use high-frequency laminates. It is recommended that you compare the dissipation factor figures of various laminates to determine which one is most suitable for your design.
Why Is the use of Fr4 density in electronics?
FR4 boards possess excellent thermal properties & remain stable and durable even when subjected to heat, without any warping or cracking.
Besides, Fr4 fiberglass and Epoxy Resin. FR4 fiberglass contains a sheet of fiberglass that provides its structure, while the epoxy resin substrate is responsible for delivering rigidity & other attributes.
The amalgamation of these two substances produces a high-density circuit board possessing excellent electrical properties, rendering FR-4 a suitable choice for insulation on PCBs.
Major Material Types of Fr4 Density
There are various variations of FR-4 based on the material thickness and chemical properties, including the FR-4 & G10. Here are some standard designations for an FR4 printed circuit board substance:
- Standard FR4: It is the prevalent form of FR4, offering excellent mechanical & moisture resistance, withstanding temperatures of around 140℃-150℃.
- FR4 With High Tg: FR4 with a high glass transition temperature is well-suited for applications that necessitate more thermal cycling & temperatures exceeding 150 degrees Celsius. Standard FR4 can only endure temperatures up to around 150℃, but FR4 having high glass transition temperature can bear more elevated temperatures.
- High CTI: FR4 having high CTI exhibits superior thermal conductivity compared to regular FR4 substances, with a tracking index greater than six hundred Volts.
- FR4 without copper laminate: A material that lacks copper in its FR4 laminate is non-conductive with remarkable mechanical strength, primarily appropriate for board supports and insulating boards.
- G10: It is a robust core material with exceptional mechanical qualities, high resistance to thermal shock, excellent dielectric rates, and effective electrical insulation.
- Fr4 circuit has two layers: The FR4 material comprises an interior fiberglass layer and an exterior epoxy resin layer possessing several properties such as:
Flame Retardant
To enhance their fire-resistant qualities, FR4 materials are blended with flame retardants. Both organic & inorganic treatments can be used for flame retardancy. Organic treatments comprise halogen compounds like bromine, fluorine, chlorine, & iodine, but inorganic treatments contain aluminum trihydrate (ATH). These compounds are useful for treating FR4 materials, rendering them fire-resistant.
Good Electrical Properties
FR-4 is a fiberglass-reinforced epoxy composite possessing commendable electrical properties, stiffness, strength & thermal resistance.
Low Moisture Absorption
FR4 material exhibits a low rate of moisture absorption, which implies that it does not alter its shape when exposed to high levels of humidity. This attribute renders it well-suited for applications in which exposure to moisture is expectable, like electronic devices & electrical components.
FR4 Material Thickness
When selecting a circuit board fabricator, the thickness(width) of the FR4 substance plays a critical role. Nonetheless, there are restrictions on how thick or thin the design can be. The typical thickness range for FR4 PCBs is between 0.2-3.2mm and changes depending on the product.
Application of Fr4 PCB Density
Common applications for FR4 are:
- Industrial Wear Uses
- Arc Shields
- Electrical Insulation
- Transformers
- Washers
- Busbars
- Switches
- Relays
- Standoffs
- Terminal Strips
Fr4 density Materials – IPC-A-600 Standards
IPC-A-600 is the guidelines that outline the specifications for producing rigid & flexible PCBs using FR4 materials. The policies cover the surface and subsurface of the base material and apply to all stages of the manufacturing process, including testing and inspection.
Benefits of Fr4 density Materials
FR4 is a versatile laminate material that boasts impressive mechanical & electrical properties. With more mechanical strength, superior dielectric properties & excellent thermal stability, FR4 is well-suited for a wide range of applications. It is also resistant to chemicals, heat, moisture & most solvents, making it a reliable choice for many industries.
Other benefits of FR4 materials include:
- FR4 is the cost-effective option over other same substances.
- It has excellent electrical insulation features due to its greater dielectric strength.
- FR4 is lightweight with a high specific strength.
- It is resistant to moisture and has good temperature resistance.
- FR4 is resistant to water, making it suitable for different PCB applications.
- The standard thickness for FR4 PCBs is typically between 0.2-3.2mm.
So these properties can make FR4 suitable for use in diverse environments.
Limitations of Fr4 density Materials
When incorporating FR4 boards into your projects, it’s important to note some of their limitations.
· Insulating Stability
FR-4 circuit boards have excellent insulating properties, but they are susceptible to damage from overloading high temperatures and extra electrical currents going through the circuit board. This can fail the board and cause a loss of proper functioning.
· Controlled Impedance
FR4 has a non-uniform dielectric constant that varies as frequency increases, unlike high-speed circuit board substances. High-speed substances have dk tolerances of less than two percent, while FR4 has more than 10% tolerances. Therefore, this poses a challenge in maintaining the impedance (capacitance) values for impedance circuit boards.
· Signal Losses
PCB design needs to consider signal loss, particularly in high-speed applications. However, FR4 material is not the optimal choice for these appliances due to its higher Df than high-frequency substances.
· Temperature Stability
FR4 boards have a limitation in their ability to withstand high temperatures. While they can handle temperatures up to a certain limit, exceeding this limit can harm the material.
General Properties of Fr4 Density
FR4 substrate has a wide range of features that make it a versatile material for PCBs in various environments. These properties include thermal conductivity, impedance matching, and low heat capacity. As a result, FR4 is commonly useful for most PCBs.
· Board Thickness
The PCB thickness is a crucial design consideration, influenced by the board’s size and functionality. Thinner panels are suitable for compact equipment, USB connectors & Bluetooth accessories. However, for larger projects, we recommend thicker boards due to narrow FR4 circuit board limitations.
· Moisture Absorption
Moisture absorption is a crucial property to consider while designing a circuit board. It refers to a material’s ability to resist moisture and determines how much humidity it can bear without degrading. Moisture absorption is measurable as the percentage of PCB material. FR4 has very low moisture absorption, only 0.10 percent when submerged in humidity for twenty-four hours. Hence, it is a perfect option for utilization in electronics fabrication.
· Glass Transition Temperature
The Tg of FR-4 falls within the range of 115-200°C, depending on the production process & resins used. Standard FR-4 PCBs consist of an FR-4 layer sandwiched between two laminated copper coatings. One of the advantages of FR-4 is its fire resistance due to the presence of bromine. FR-4 has largely swapped G-10 compounds in an electronic circuit because of its lower price, superior mechanical strength & excellent insulating properties in dry and humid environments.
FR-4 classification and its electrical & physical properties are defined by the National Electrical Manufacturers Association LI 1-1998 standard. Each FR-4 substance has a composition and structure. The primary fiberglass layer provides FR4 with its stability, while the fire-resistant epoxy resin provides its rigidity. Additionally, FR4 exhibits excellent mechanical & insulating properties in both dry & humid environments.
You can use FR4 as a basic insulating material for PCBs. A production company will construct the board on an FR4 circuit board and composite it with a copper sheet to create the final product. PCBs frequently have multiple sides and multi-layer solder resist. These solders resist layers make the circuit for an absolute top overlay layer and allow for V-grooves.
Factors to Consider While Choosing Fr4 density PCB
When selecting an FR4 printed circuit board, various factors should be considered. The most important factor is the durability and quality of a product. While some producers sell the products at a very affordable price, they may not guarantee product quality. To ensure you purchase a high-quality FR4 printed circuit board, it’s essential to read as many reviews as possible before making a purchase. Other factors include:
· Sheet Thickens
The sheet thickness is a crucial factor in determining the number of layers that your board can have. Thicker sheets are more durable and ideal for high-density interconnect boards.
· Impedance Matching
It is a critical aspect of any electrical board, as it ensures that all components of your circuit function together seamlessly without any interference.
· Spacing
The current carrying capacity of a circuit board is affectable by the spacing between the copper traces. When the trails are too close, the board’s ability to carry current decreases
FR-4 Material vs. Rogers Material
- The cost of Rogers’s material is significantly higher than that of FR-4 substance.
- Rogers’s material has superior high-frequency handling capabilities compared to FR-4 material.
- FR-4 material has a higher dissipation factor, leading to higher signal loss compared to Rogers material.
- Rogers material offers broader Dk values, making it more impedance-stable than FR-4 material.
- The dielectric constant of Rogers material ranges from 6.15-11, while that of FR-4 material is approximately 4.5.
- Rogers substance has a low-temperature variation than FR-4 material.
Wrap Up!
In conclusion, FR4 is a highly advantageous material due to its high strength, low weight & resistance to chemicals and fire. As a result, it has become a popular choice in the production industry.
If you require an FR4 producer for PCBs or boards manufactured by other substances, RayPCB can assist you. We offer quality boards & circuits in all quantities, prioritizing quality and timely delivery.
