Board material: Panasonic MEGTRON8 (R-5795)

Thickness: 0.8mm

Number of layers：10 layers PCB

Minimum line width/spacing: 2/2mil

Finished copper thickness: inner layer 0.5OZ, outer layer 1OZ

Acceptance standard: IPC6012 CLASS 3 level

Surface technology: immersion gold + OSP

Dielectric constant: 3.08

Loss factor: 0.0012

Usage: Communication

About 10 layers of Anylayer HDI Communication Boards

High-Density Interconnect (HDI) communication boards are essential components in modern electronic systems, enabling efficient data transfer and signal transmission. Anylayer HDI boards, in particular, have gained widespread popularity due to their exceptional performance and versatility. In this comprehensive article, we will explore the intricacies of Anylayer HDI communication boards with up to 10 layers, providing valuable insights into their design, construction, and applications.

Layers in HDI Communication Boards

HDI communication boards are characterized by their multilayer structure, with each layer serving a specific purpose. The number of layers in a board directly influences its complexity, routing capabilities, and overall performance. Let’s delve into the details of each layer:

1. Signal Layers

Signal layers are responsible for carrying high-speed digital signals, enabling efficient data transfer between various components on the board. These layers are meticulously designed to minimize signal interference, crosstalk, and other electromagnetic compatibility (EMC) issues.

2. Power Planes

Power planes are dedicated layers that distribute power to the various components on the board. These layers are designed to ensure a stable and consistent power supply, minimizing voltage drops and ensuring proper device operation.

3. Ground Planes

Ground planes are essential for providing a reference potential and minimizing electromagnetic interference (EMI). They act as a shield, reducing noise and ensuring signal integrity. Ground planes are often alternated with signal layers to maintain signal quality.

4. Prepreg Layers

Prepreg layers are insulating materials placed between the conductive layers. These layers contribute to the overall thickness and rigidity of the board while providing electrical insulation between the signal, power, and ground layers.

5. Blind and Buried Vias

Blind and buried vias are specialized via structures that connect different layers within the board. Blind vias connect an outer layer to an inner layer, while buried vias connect two inner layers without reaching the outer layers. These vias enable efficient routing and signal transmission.

6. Microvias

Microvias are tiny, high-density vias that provide interconnections between layers in HDI boards. They enable higher component density and facilitate efficient routing in space-constrained designs.

7. High-Density Interconnect (HDI) Layers

HDI layers are specialized layers that incorporate advanced manufacturing techniques, such as laser drilling and sequential lamination, to create high-density interconnects. These layers enable the integration of fine-pitch components and high-density routing.

8. Embedded Components

In advanced HDI board designs, components like capacitors, resistors, and even active devices can be embedded directly into the board layers. This integration reduces board size, improves electrical performance, and enhances overall system reliability.

9. Thermal Management Layers

Thermal management is crucial in high-performance electronic systems. Dedicated thermal management layers, often composed of materials with excellent thermal conductivity, help dissipate heat efficiently, ensuring reliable operation and extended component lifespan.

10. Shielding Layers

Shielding layers are designed to prevent electromagnetic interference (EMI) and radio frequency interference (RFI) from affecting the board’s performance. These layers are typically made of conductive materials and are strategically placed within the board’s layer stack.

Applications of Anylayer HDI Communication Boards

Anylayer HDI communication boards find applications in a wide range of industries and applications, including:

Conclusion

Anylayer HDI communication boards with up to 10 layers offer unparalleled performance, density, and versatility in modern electronic systems. By carefully designing and constructing these multilayer boards, engineers can achieve efficient signal transmission, thermal management, and shielding from electromagnetic interference. As technology continues to advance, the demand for high-density interconnects and advanced HDI board designs will only continue to grow, enabling the development of increasingly complex and high-performance electronic systems.

The post RAYMING Panasonic MEGTRON8 10 Layer Anylayer HDI communication PCB appeared first on RAYMING PCB.

Board material: S1170G (halogen-free)

Thickness: 1.2mm

Layer Number：8 layers

Minimum line width/spacing: 3/3mil

Finished copper thickness: inner layer 1OZ, outer layer 1OZ

Acceptance standard: IPC6012 CLASS 2 level

Surface technology: immersion gold

Dielectric constant: 4.4

Loss factor: 0.010

Usage: Medical equipment

Shengyi S1170G 8 Layer 1st Order HDI Medical Equipment PCB Board

In the ever-evolving world of medical technology, printed circuit boards (PCBs) play a crucial role in enabling advanced medical equipment and devices. One such PCB that has gained significant recognition is the Shengyi S1170G 8 Layer 1st Order HDI Medical Equipment PCB Board. This high-density interconnect (HDI) board is specifically designed to meet the stringent requirements of medical applications, ensuring reliable and efficient performance in critical healthcare environments.

HDI Technology in Medical PCBs

HDI technology has revolutionized the PCB industry by enabling higher component density, improved signal integrity, and enhanced thermal management capabilities. In the medical field, these advantages translate into smaller, more compact devices with increased functionality and reliability.

The Shengyi S1170G 8 Layer 1st Order HDI Medical Equipment PCB Board incorporates advanced HDI features, such as microvias, buried vias, and sequential lamination, to achieve a high-density interconnect structure. This design allows for intricate routing patterns, enabling the integration of complex circuitry and high-speed signals within a compact footprint.

Shengyi S1170G 8 Layer 1st Order HDI Board Specifications

The Shengyi S1170G 8 Layer 1st Order HDI Medical Equipment PCB Board is designed to meet the demanding requirements of medical applications. Here are some key specifications:

Layer Configuration

The board consists of 8 layers, including:

• 4 signal layers
• 2 power planes
• 2 ground planes

This multilayer configuration ensures efficient signal routing, stable power distribution, and effective noise suppression, all essential factors in medical equipment design.

Materials and Construction

The board is constructed using high-quality materials suitable for medical applications, such as:

• Base material: FR-4 or high-performance laminates
• Copper weight: Ranging from 0.5 oz to 2 oz (depending on application requirements)
• Solder mask: Liquid photoimageable or dry film solder mask
• Surface finish: Immersion silver, immersion tin, or ENIG (Electroless Nickel Immersion Gold)

These materials are carefully selected to ensure biocompatibility, reliability, and durability in medical environments.

Electrical and Thermal Performance

The Shengyi S1170G board is designed to support high-speed signals, with features like controlled impedance traces and low-loss materials to maintain signal integrity. Additionally, the HDI structure and specialized thermal management layers contribute to efficient heat dissipation, ensuring stable operation and prolonged component life.

Certifications and Compliance

As a medical equipment PCB board, the Shengyi S1170G adheres to strict industry standards and certifications, such as:

• IPC-6012 Class 3 or Class 3A
• RoHS and REACH compliance
• ISO 13485 (Medical Devices Quality Management System)
• FDA and CE marking (for specific medical device applications)

These certifications ensure that the board meets stringent quality, safety, and environmental regulations, making it suitable for use in critical medical applications.

Applications of Shengyi S1170G HDI Medical PCBs

The Shengyi S1170G 8 Layer 1st Order HDI Medical Equipment PCB Board finds applications in a wide range of medical devices and equipment, including:

The high-density interconnect capabilities and reliable performance of the Shengyi S1170G board make it an excellent choice for these critical medical applications, where failure is not an option.

Conclusion

The Shengyi S1170G 8 Layer 1st Order HDI Medical Equipment PCB Board represents a significant advancement in medical electronics manufacturing. Its advanced HDI construction, carefully selected materials, and adherence to stringent industry standards ensure reliable and efficient performance in demanding medical environments. As the healthcare industry continues to evolve, PCBs like the Shengyi S1170G will play a pivotal role in enabling innovative medical technologies that improve patient care and save lives.

The post RAYMING Shengyi S1170G 8 Layer 1st Order HDI Medical Equipment PCB Board appeared first on RAYMING PCB.

Board Material: TU-662

Thickness: 1.6mm

Layer Number：4 layers PCB

Minimum line width/spacing: 6/6mil

Finished copper thickness: inner layer 2OZ, outer layer 2OZ

Acceptance standard: IPC6012 CLASS 2 level

Surface technology: lead-free HASL

Dielectric constant: 4.3

Loss factor: 0.014

Usage: Household air purifier

4 Layer IoT Household Air Purifier PCB

In today’s world, air quality has become a significant concern, particularly in urban areas where pollution levels are high. Household air purifiers have emerged as a popular solution to combat indoor air pollution, providing cleaner and healthier air for families. At the heart of these air purifiers lies a crucial component: the printed circuit board (PCB). In this article, we will explore the 4 Layer IoT Household Air Purifier PCB, its design considerations, and its role in enabling efficient and intelligent air purification systems.

IoT Integration in Air Purifiers

The Internet of Things (IoT) has revolutionized various industries, and air purifiers are no exception. IoT technology allows household air purifiers to be connected to the internet, enabling remote monitoring, control, and data analysis. The 4 Layer IoT Household Air Purifier PCB is designed to integrate IoT capabilities, facilitating seamless connectivity and intelligent operation.

PCB Layer Configuration

The 4 Layer IoT Household Air Purifier PCB consists of the following layers:

1. Top Signal Layer
2. Ground Plane
3. Power Plane
4. Bottom Signal Layer

This layer configuration ensures efficient signal routing, noise suppression, and stable power distribution, which are crucial for the proper functioning of the air purifier’s electronic components.

Design Considerations

When designing a 4 Layer IoT Household Air Purifier PCB, several factors must be taken into consideration:

1. Electromagnetic Compatibility (EMC)

Air purifiers operate in close proximity to other electronic devices within the household. To ensure proper operation and prevent electromagnetic interference (EMI), the PCB design must comply with EMC standards. This includes proper grounding techniques, shielding, and careful component placement.

2. Power Management

Efficient power management is essential for air purifiers, as they are designed to operate continuously. The PCB must incorporate power management circuits and components to ensure optimal power consumption and battery life (if battery-powered).

3. Sensor Integration

Air purifiers rely on various sensors to monitor air quality, such as particulate matter (PM) sensors, volatile organic compound (VOC) sensors, and gas sensors. The PCB design must accommodate these sensors and provide appropriate signal conditioning and processing capabilities.

4. Connectivity Options

In addition to IoT connectivity, the PCB may need to support other wireless technologies, such as Wi-Fi, Bluetooth, or Zigbee, to enable local control and data transfer. Adequate provisions for antenna placement and RF signal routing should be considered.

5. Thermal Management

Certain components on the PCB, such as microcontrollers and power management circuits, may generate heat during operation. Proper thermal management techniques, including copper pour areas and thermal vias, should be implemented to ensure reliable performance and longevity.

Applications and Benefits

The 4 Layer IoT Household Air Purifier PCB finds applications in a variety of air purification systems designed for residential and commercial spaces. Some key benefits of using this PCB include:

By leveraging the capabilities of the 4 Layer IoT Household Air Purifier PCB, manufacturers can offer intelligent, efficient, and user-friendly air purification solutions to consumers.

Conclusion

The 4 Layer IoT Household Air Purifier PCB plays a crucial role in enabling advanced air purification systems for residential and commercial spaces. With its multilayer design, IoT connectivity, and integration of various sensors and components, this PCB facilitates intelligent air quality monitoring, energy-efficient operation, and remote control capabilities. As air pollution concerns continue to rise, the demand for smart and efficient air purifiers will increase, driving further innovation in PCB design and integration for these essential household appliances.

The post RAYMING 4 Layer IoT Household air purifier PCB appeared first on RAYMING PCB.

Board material: NPG-170N (halogen-free)

Thickness: 2.0mm

Number of layers：10 layers

Minimum line width/spacing: 5/5mil

Finished copper thickness: inner layer 2OZ, outer layer 1OZ

Acceptance standard: IPC6012 CLASS 3 level

Surface technology: immersion gold

Dielectric constant: 4.2

Loss factor: 0.010

Usage: Automobile driving control

The post RAYMING 10 Layer halogen free IPC Class 3 Automotive Control PCB appeared first on RAYMING PCB.

Board Material：Wangling F4BTMS220

Thickness: 0.85mm (media thickness 0.762mm)

Number of layers: 2 layers PCB

Minimum line width/spacing: 10/10mil

Finished Copper Thickness: Outer layer 2OZ

Acceptance standard: GJB9001C

Surface technology: immersion tin

Dielectric constant: 2.2+/-0.02

Loss Factor: 0.0011

Usage: Confidential

The post RAYMING F4BTMS220 High Frequency Immersion Tin PCB Board appeared first on RAYMING PCB.

Board material: aluminum substrate

Thickness: 1.6mm

Layer number：2 layers aluminum PCB

Finished copper thickness: 3OZ

Minimum aperture: 1.2mm

Surface technology: OSP

Application areas: household lighting

Product features: double-sided aluminum substrate, thermal conductivity 3W

The post RAYMING 2 Layer 3oz 3W Double-sided Aluminum based high-power LED light PCB board appeared first on RAYMING PCB.

Board material：Taiwan Juding copper Substrate

Thickness: 3.0mm

Number of layers：2 layers PCB

Finished copper thickness: 4 OZ

Minimum aperture: 2.0mm

Surface treatment: immersion gold

Metal-based thermal conductivity: 1.0W/m-K

Application areas: new energy automobile power battery

The post RAYMING 3.0mm 4Oz New Energy Vehicle Battery Copper Substrate PCB appeared first on RAYMING PCB.

Rigid part: 4 layer PCB

Flex part:  1 layer Flex PCB 

Solder Mask: Green

Surface Process: Immersion Gold

Application:  Industrial Robot Arm

The post RAYMING 4 Layer rigid + 1 Layer Flex PCB Rigid-flex Board appeared first on RAYMING PCB.

Technical: Half hole PCB

Layer: 4 Layer PCB

Surface Process: Gold Plating 

Application: Industrial Control

The post RAYMING 4 Layer Half hole Gold Plating PCB Board appeared first on RAYMING PCB.

Layer: 2 Layer PCB

Copper: 10 OZ

Surface Process: Immersion Gold

Application:  Power Supply

The post RAYMING 2mm 10 oz 2 layer Power supply Extreme Copper PCB appeared first on RAYMING PCB.