Layers: 2 layers PCB
Material: Aluminum Oxide Ceramic
Plate thickness: 1.0+/-0.05mm
Plate used: 96% aluminum oxide
Surface treatment: immersion gold
Thermal conductivity of insulation layer: 30W
Outer copper thickness: 35um
Gold thickness: >=2′
Process characteristics: dpc process
Alumina ceramic substrate is a precision ceramic material with the following advantages:
High heat resistance and thermal conductivity: alumina ceramic substrate has excellent heat resistance and thermal conductivity, can withstand high temperature environment and conduct heat effectively.
High mechanical strength: alumina ceramic substrate has high strength and hardness, able to withstand mechanical stress.
Good electrical insulation properties: alumina ceramic substrate has good electrical insulation properties, can be used in the manufacture of electronic components that require high insulation properties.
Good chemical stability: alumina ceramic substrate has excellent chemical stability, can resist the erosion of various chemical substances, to maintain its stable performance.
Alumina ceramic substrates also have the advantages of high biocompatibility and low coefficient of thermal expansion. In terms of application, alumina ceramic substrates are widely used in LED power lighting, high-power power semiconductor modules, power control circuits, intelligent power components, automotive electronics, aerospace and military electronic components and other fields.
