Layers: 6 Layer PCB
Material: RO3003+FR4
Special process: hole in disk + impedance + blind buried hole 1-2
Minimum hole diameter: blind hole 0.1mm, through hole 0.2mm
Outer layer line width/spacing: 5/2.5mil
Surface Process: OSP
PCB thickness: 1.6mm
What’s Rogers RO3003 + FR4 hybrid PCB board
Rogers RO3003 and FR4 are two different materials used in the manufacturing of printed circuit boards (PCBs). The combination of these two materials in a hybrid PCB board can provide a balance between performance and cost-effectiveness for certain applications.
Rogers RO3003 is a high-frequency laminate material that is designed for use in applications that require low loss and consistent electrical performance up to high frequencies. It is a thermoset ceramic-filled hydrocarbon material with a relatively high dielectric constant and low dissipation factor, making it suitable for high-speed digital and RF/microwave applications.
FR4 (Flame Retardant 4) is a glass-reinforced epoxy laminate material that is widely used in the manufacturing of conventional PCBs. It is a cost-effective material with good mechanical and electrical properties, but it has higher signal loss and lower performance compared to materials like RO3003, especially at higher frequencies.
The combination of RO3003 and FR4 in a hybrid PCB board allows for the selective placement of the high-performance RO3003 material in critical areas of the circuit, such as high-speed or high-frequency signal paths, while using the more cost-effective FR4 material for other areas of the board. This hybrid approach can provide a balance between performance and cost, making it suitable for applications that require both high-frequency performance and cost optimization.
Hybrid PCB boards with RO3003 and FR4 are often used in applications such as wireless communication systems, radar systems, satellite communication systems, and other high-frequency or high-speed electronic devices where signal integrity and cost are both important factors.
It’s important to note that the design and layout of a hybrid PCB board require careful consideration to ensure proper signal integrity and minimize potential issues such as signal reflections or crosstalk between the different materials.
