Xilinx has consistently proven its name in the field of manufacturing Programmable Logics, Integrated Circuits (ICs) and Field Programmable Gate Arrays (FPGAs).
The company has now delved into a new dimension – System on a Chip (SoC). Unlike the previous products, an SoC is designed to provide “full-suite” electronic device configuration options. With it, you can configure and optimize your electronic devices without necessarily using multiple external components.
This article explains how the Xilinx XCZU9EG-2FFVB1156E SoC may be able to turn around the fortunes of your electronic device designs and make them wholesome.
Understanding the Concept of SoC
System on a Chip (SoC) as the name connotes, is more of a “system sitting on a chip.” You can think of it as a chip that contains most of the peripherals and components you need to design your electronic products.
Xilinx XCZU9EG-2FFVB1156E’s SoC does not only have most of these components. It also has a wide range of application and offers low-cost, high-performance for the applications.
Xilinx XCZU9EG-2FFVB1156E Features
The features of the Xilinx XCZU9EG-2FFVB1156E SoC includes but are not limited to 7 cores, multiple core processors and a host of logic cells and elements.
Talking about the core processors, it uses the trio of ARM Cortex A53, ARM Cortex R5 and ARM Mali-400 MP2.
The ARM Cortex A53 is adjudged to be one of the best processors to use when executing complex projects. According to the manufacturer, the “Cortex-A53 can be implemented in two execution states: AArch32 and AArch64. The AArch64 state allows execution of 64-bit applications. The AArch32 state allows execution of existing Armv7-A applications.”
With this explanation, you can deduce that Xilinx XCZU9EG-2FFVB1156E’s ARM Cortex A53 is capable of dual-issuing some instructions to be used during the board’s development.
We also have the ARM Cortex R5, a core processor enabling the improvement of designs in the areas of enhanced error management and extended functional security. The core processor also “provides extended fault containment for real-time applications.”
The third core processor used by Xilinx XCZU9EG-2FFVB1156E is the ARM Mali-400 MP2. It sees to the reduction of power and bandwidth consumption in the board. It also enables improved performance of the product.
Technical Specifications of Xilinx XCZU9EG-2FFVB1156E SoC
Here is a table highlighting the technical attributes of Xilinx XCZU9EG-2FFVB1156E’s System on a Chip (SoC):
| Technical Attributes | Description |
| Screening Level | Extended Industrial |
| Moisture Sensitivity Level (MSL) | Yes, 4 (72 hours) |
| Operating Temperature | 0-degree Celsius to 100-degree Celsius |
| Architecture | Field Programmable Gate Array (FPGA) and Microcontroller (MCU) |
| Package/Case | 1156-BBGA, FCBGA |
| Peripherals | DMA, WDT |
| Number of I/O | 328 |
| Speed Grade | 2 |
| Speed | 533 MHz, 600 MHz, and 1.3 GHz |
| Primary Attributes | Zynq UltraScale + FPGA, 559 Logic Cells |
| Number of Registers | 548,160 |
| In System Programmability | No |
| Operating Supply Voltage (min-max) | 0.808 volts to 0.892 volts |
| RAM Size | 256 kilobytes |
| Connectivity Options | CANbus, USB OTG, EBI/EMI, UART/USART, Ethernet, SPI, I2C and MMC/SD/SDIO. |
| Number of Logic Elements (LE) | 599,500 |
| Pin Count | 1,156 |
Xilinx XCZU9EG-2FFVB1156E Conclusion
You can get started on the right foot with your Xilinx XCZU9EG-2FFVB1156E design by contacting a professional digital designer. RayPCB is ready to take your orders and help you configure the SoC according to your specifications.
