An Introduction to Rogers PCB and Its Manufacturing
Rayming is 18 years Rogers PCB Manufacturing experience, We can manufacture PCB Basing on Following materials: RO4003C, RO3003C, RO4350B, RO5880, RO5870…
What is Rogers PCB ?
Rogers PCB is a type of high-frequency board that raw material is produced by Rogers company. It is different from the conventional PCB board—epoxy resin (FR4). It has no glass fiber in the middle and uses a ceramic base as the high-frequency material. Rogers has superior dielectric constant and temperature stability. Its dielectric constant thermal expansion coefficient is very consistent with copper foil, which can be used to improve the deficiencies of PTFE substrates. It is very suitable for high-speed electronic design, commercial microwave, and radio frequency applications. Its low water absorption is ideal for high-humidity applications, providing customers in the high-frequency board industry with the highest quality materials and related resources, which fundamentally enhance product quality.
ROGERS 4003C and ROGERS 4350B have excellent low dielectric loss characteristics. As a result, they provide a more cost-effective and processable high-frequency material selection than PTFE. They are widely used in antennas of the cellular base station and power amplifiers, microwave point-to-point connection (P2P), automotive radars and sensors, radio frequency identification (RFID), direct broadcast satellite high-frequency head (LNB), and other fields. In addition, the thermal expansion coefficient of the X and Y-axis is similar to that of copper. The expansion coefficient of the Z-axis is much lower than FR4 (46ppm/ oC) and has a higher Tg value (>280oC), thus ensuring good thermal stability. The dimensional stability and high reliability of the entire product in PCB processing and assembly will bring more benefits to the design of multilayer circuits.
When the circuit’s operating frequency is above 500MHz, the range of materials that design engineers can choose is significantly reduced. Rogers RO4350B material allows RF engineers to conveniently design circuits, such as network matching and impedance control of transmission lines. Due to its low dielectric loss characteristics, in high-frequency applications, RO4350B material has more advantages than ordinary circuit raw materials. Its dielectric constant with temperature fluctuation is almost the lowest among similar materials. In a wide frequency range, its dielectric constant is also relatively stable at 3.48; the recommended design value is 3.66. LoPra copper foil can reduce insertion loss, which makes the material suitable for broadband applications.
RayMing always stocks most the thickness and specifications of RO4003C, RO3003C, RO4350B, RO5880, RO5870, and RO4450F prepregs, which can meet your immediate response PCB needs. We have rich experience in RFID data process engineering and a complete high-frequency material processing control system to ensure product design functions.
In PCB prototyping, Rogers is a unique circuit board with a specific technical threshold, difficult to operate, and high cost. General PCB factories rarely fulfill orders due to the troublesome production methods and the small number of customer orders. RayMing is engaged in the PCB prototype manufacturer of Rogers high-frequency PCB boards, which can meet the various high-frequency PCB needs of customers. Currently, it can achieve 4~10 layers of ceramic pure pressure and 4~12 layers of mixed pressure.
RayMing is very proud of supporting the military. We were contracted to assemble a PCB for use in a military communications application and provided Rogers 4350, Rogers 4003, and RT5880 material assembly services. There are no MOQ 1 panelization is ok. We will perform final testing using automated optical inspections and x-ray inspection prior to product delivery. There will be strict impedance control following specification with a testing report.
With services (special 5G application) from consumer to military PCB industries, we continuously strive to build Rogers PCB products that exceed your expectations, develop long-term customer relationships, and become your best possible manufacturing partner.
RayMing stocks most of rogers material model in our warehouse, and we produce pure Rogers PCB or mix-press PCB boards: FR4+Rogers PCB and Aluminum+Rogers PCB. If you have a special design and material request, please send your design and requirement to sales@raypcb.com with your PCB stack-up. If you need design suggestions and consultation, you are welcome to contact us.
In order to support R&D for universities and institutions, bare Rogers PCB is for sale at a competitive price, even with small quantity orders. Please contact RayMing for more information.
Rogers vs. FR4
Here is a comparison between FR4 and Rogers PCB material. Almost 80% of electronic circuit boards are manufactured with FR4 material. What is the difference between FR4 material and Rogers PCB material?
Here is a comparison chart:
All RF boards need to control signal loss. From the diagram, Rogers PCB material performs better than FR4. As 5G is on the horizon, Rogers PCB market will increase, and prices will decrease. If your design involves any types of signal transmission, we strongly recommend materials from Rogers.
What is Rogers Material?
Rogers is a leading global materials technology company that develops advanced circuit board laminate materials used in high frequency, high performance printed circuit boards (PCBs). Some of the key things to know about Rogers materials:
- Develops a wide range of circuit board substrate materials engineered for different applications and performance requirements. Popular materials include RO4000, RO3000, RT/duroid, and many others.
- Specializes in high frequency materials for use in radio frequency (RF) and microwave PCBs and components. Allows precision electrical performance.
- Offers both rigid and flexible circuit laminates compatible with common PCB manufacturing processes.
- Utilizes specialized proprietary formulations to create materials with specific dielectric, thermal, and mechanical characteristics.
- Rogers’ material technology enables higher circuit densities, improved signal speed and integrity, and enhanced reliability in PCBs.
- Complies with major industry standards such as UL, IPC, and RoHS. Certified for aerospace, defense, telecom, automotive and other critical applications.
- Used by PCB manufacturers worldwide to construct high-end circuit boards for advanced electronic devices.
Overview of Rogers' Circuit Board Materials
Rogers offers one of the industry’s widest selection of circuit board substrate materials to meet the needs of various applications:
RO4000 Series High Frequency Laminates
The RO4000 series consists of ceramic-filled thermoset laminates designed for exacting circuit boards operating at up to mmWave frequencies. It delivers excellent dimensional stability, low thermal expansion, and outstanding high frequency performance. Some options include:
- RO4003TM – Most common version for wireless, aerospace, defense, and instrumentation applications.
- RO4350BTM – Higher thermal conductivity for power circuits and heat spreading.
- RO4450TM – Improved thermal cycle reliability performance.
- RO4835TM – Lightweight material alternative with similar electrical features.
RO3000 Series High Frequency Laminates
The RO3000 series offers more affordable circuit materials compared to the RO4000 series, making them popular for cost-sensitive commercial applications. Options include:
- RO3010TM – General purpose microwave material with good high frequency performance.
- RO3006TM – Higher permittivity and thermal conductivity for power modules.
- RO3003TM – High frequency laminate with improved insertion loss over RO3010.
RT/duroid High Frequency Laminates
RT/duroid materials are specially engineered to provide tightly controlled electrical parameters for optimal circuit functionality. They are halogen-free. Variants include:
- RT/duroid 5870 – Low loss material for high power density in mmWave applications.
- RT/duroid 6035HTC – High thermal conductivity and low loss for power amplifiers and antennas.
- RT/duroid 6002 – Cost-optimized microwave laminate with improved thermal performance over RO4350B.
RO1200 Low Flow Prepregs
RO1200 low flow prepregs consist of liquid crystal polymer films designed primarily for multilayer PCB constructions requiring excellent dimensional stability. Common versions are RO1200TM and RO1220TM.
TMM Thermoset Microwave Materials
The TMM series offers a selection of thermoset micro-dispersed ceramic-filled materials covering a wide range of dielectric constants for broadband applications. Options include TMM3, TMM4, TMM6, TMM10i, and more.
lexible LCP and PTFE Films
Rogers’ flexible circuit materials provide excellent high frequency performance in a thin, lightweight form factor. These include ULTRALAM® liquid crystal polymer (LCP) films and RT/duroid® PTFE composites.
Other Specialty Materials
Additional Rogers’ materials technologies include ceramic-filled thermal endmatch materials, damping materials, beam window materials, polyimide films, and more for specific applications.
Rogers also offers quick-turn prototyping materials under its ProtoBONDTM brand.
Benefits of Rogers Materials for PCBs
Using Rogers materials for circuit board fabrication provides these key advantages:
High Frequency Performance – Provides stable dielectric constant and low loss characteristics for optimal electrical functionality in RF, microwave, and millimeter wave applications. Allows higher operating frequencies.
Thermal Management – Specialized formulations available with high thermal conductivity, low coefficient of thermal expansion, and excellent thermal stability for managing heat in circuit boards. Critical for power devices.
Miniaturization – Consistent and reliable electrical properties allow construction of higher complexity boards, components, circuits, and electrical features within a given area for greater miniaturization.
Signal Integrity – Excellent dimensional stability along with fine microstructures result in smooth copper surfaces that greatly improve signal speed, quality, and signal integrity through PCB traces.
Reliability – Long-term material stability, adhesion, and durability support reliability requirements of defense, aerospace, automotive, and other long-life applications.
Design Flexibility – Wide range of material thicknesses, sizes, certifications, dielectric constants, loss tangents, and other parameters provides extensive design flexibility.
Ease of Processing – Compatible with standard circuit board fabrication techniques like imaging, drilling, plating, and assembly allowing use with existing PCB processes and equipment.
Regulatory Compliance – Materials comply with major environmental and regulatory standards for use in stringently controlled industries and applications.
Rogers PCB and Laminate Manufacturing Process
To produce finished circuit boards using Rogers materials, PCB fabricators use specialized processes tailored to the properties of Rogers laminates:
Sourcing Rogers Materials
- Rogers works with a global network of qualified distributors to supply their various circuit board materials to PCB manufacturing partners.
- Manufacturers can source Rogers’ materials in sheet, panel, or roll formats depending on needs.
- Rogers provides technical advice to manufacturers on optimal material selection.
Incoming Inspection
- Rogers material quality and lot traceability is verified upon receipt.
- Dimensional tolerances, hole locations, thickness, and other parameters are measured.
Panel Preparation
- Rogers laminate sheets are cut to sized panels for imaging and plating steps.
- Tooling holes are precision drilled for layer-to-layer alignment during lamination.
Imaging
- Laminate surfaces are prepared and coated with photoresist.
- An imagable film is then exposed to define the circuit pattern traces and features.
Etching
- The exposed surfaces are etched away to selectively remove exposed copper, isolating circuit traces.
Automated Optical Inspection (AOI)
- Optical inspection validates trace positioning, widths, spacing, butting, etc. match design data.
Plating and Coating
- Surfaces are plated with copper and coated where required for solder mask, silkscreen, and other finishes.
Lamination
- Individual boards are laminated together under heat and pressure to form multilayer boards with traces and vias between layers.
Drilling
- Holes are precisely drilled for component pins and inter-layer connections using small microvias.
Routing
- Boards are routed from panel to individual PCB dimensions based on specific designs.
Testing
- Electrical testing validates continuity, resistance, and board performance matches specifications.
- Quality assurance testing screen for defects.
Final Finishes
- Optional conformal coating or potting can protect boards from environmental factors.
- Specialized markings or cosmetic finishes may be applied.
Packaging and Shipment
- Finished Rogers PCBs are cleaned, baked, and carefully packaged to ship to product manufacturers for assembly and integration into electronic systems.
By following optimized fabrication processes tailored to Roger’s material properties, PCB fabricators can produce high quality, high performance printed circuit boards from Rogers laminates.
Major Applications of Rogers Materials
The high frequency capabilities and reliable performance of Rogers materials makes them well suited for:
- Wireless Communications – Used in 5G NR mmWave antennas, massive MIMO arrays, remote radio heads, base stations, backhaul links, and other wireless infrastructure.
- Satcom & Radar – Used in satellite communications, phased array radar systems, GPS equipment, and other high frequency aerospace and defense electronics.
- Automotive Radar – Used in collision avoidance radar PCBs for advanced driver assistance systems in modern vehicles.
- High-Speed Data – Used in networking equipment, data centers, test equipment, and oscilloscopes for high-bandwidth applications.
- Smart Weaponry – Used in “smart” munitions, guided missiles, drones, and other military electronics requiring reliable high frequency circuit boards.
- Aerospace & Avionics – Used in in-flight entertainment systems, communications, onboard electronics, and other commercial and military aircraft systems.
- 5G Phased Arrays – Used in high performance 5G beamforming antenna arrays for improved speed and coverage.
- Medical Imaging – Used in MRI, X-Ray, and other imaging equipment operating at UHF, microwave, and mmWave frequencies.
- Test & Measurement – Used in oscilloscopes, signal generators, and other lab equipment for high-frequency measurements.
- Radar Housings – Used in structural radomes, modules, and housings for protecting sensitive radar electronics.
- Industrial/Scientific – Used in high power industrial RF generators and processing equipment used for scientific research.
The specialized high frequency properties of Rogers materials makes them a top choice for these cutting-edge applications.
Rogers PCB Manufacturers and Fabricators
Many PCB fabricators worldwide utilize Rogers materials to construct high-performance printed circuit boards:
Large Fabricators
- TTM Technologies
- Sanmina Corporation
- Flex Ltd.
- AT&S
- Multek
Mid-Size Fabricators
- APCT
- Lenthor Engineering
- Eastern Electronics
- Sierra Circuits
- Bittele Electronics
- Epec
Small Fabricators
- Ohmega Technologies
- Photocircuits
- Quick Turn Circuits
- Sunstone Circuits
- Advanced Assembly
- Screaming Circuits
Rogers maintains relationships with these qualified PCB manufacturing partners and helps connect product designers and engineers to reputable fabricators that can build Rogers-based circuit boards for their needs.
Rogers also works closely with these fabricators to educate them on best practices for processing Rogers materials using qualified procedures. Rogers provides extensive technical documentation and guidelines to manufacturers that cover every step of the PCB fabrication process with their materials.
Designing Rogers PCBs
To utilize Rogers materials effectively in circuit board designs, engineers should follow these guidelines:
Choose the Right Material – Select the specific Rogers laminate that provides the right combination of dielectric constant, loss tangent, thermal conductivity, and other needs for optimal performance.
Leverage Rogers’ Models – Take advantage of Rogers’ material models for simulations to accurately model performance.
Follow Layout Guidelines – Designs must adhere to fabrication capabilities and constraints for parameters like:
- Trace width/spacing
- Minimum hole size
- Impedance tolerances
- Line-to-line spacing
- Layer stackup
Design for Thermal Management – Ensure designs adequately dissipate heat from components to prevent temperature related performance issues or reliability concerns.
Account for Coefficients – Designs must factor in the coefficient of thermal expansion and other material specific coefficients.
Leverage Rogers’ Technical Support – Take advantage of Rogers’ extensive design support, resources, and expertise in high frequency design techniques.
Following these guidelines helps engineers fully unlock the capabilities of Rogers circuit board materials for their specific application needs.
Conclusion
For over 60 years, Rogers Corp has pioneered cutting-edge materials science to create high performance circuit board laminates that enable today’s most advanced PCB designs and electronic devices.
With its portfolio of materials engineered specifically to deliver stable, reliable electrical performance at microwave, millimeter wave, and Terahertz frequencies, Rogers provides the technology foundation for 5G communications, vehicle radars, aerospace electronics, defense systems, and other emerging applications.
By selecting the optimal Rogers’ material, leveraging qualified PCB fabricators, and designing effectively for their specialized properties, engineers can utilize these materials to push the boundaries of speed, signal integrity, miniaturization, and reliability in their electronic products and systems.
Rogers PCBs - Frequently Asked Questions
Q: What are some key differences between Rogers RO4000 and RO3000 series materials?
A: The RO4000 series offers higher performance but at a premium cost over the RO3000 series. Key differences:
- RO4000 has a lower dielectric constant for better high frequency response.
- RO4000 has lower loss for optimal signal integrity.
- RO4000 features better impedance control and consistency.
- RO3000 series is more cost optimized for commercial applications.
- RO4000 offers higher thermal conductivity options.
- RO4000 features a smaller z-axis CTE for enhanced reliability.
Q: When should flexible Rogers materials be used instead of rigid materials?
A: Reasons to use flexible Roger’s materials include:
- Enabling flexible or conformal circuits
- When extreme thinness and lightweight is required
- For dynamic flexing environments
- For portable and wearable devices
- For space/weight constrained aerospace applications
- For flexible interconnects and antennas
- For multilayer constructions by interleaving flex/rigid
Q: What are some key design considerations when using Rogers materials?
Some key considerations include:
- Selecting the optimal material to meet electrical, thermal, and mechanical needs.
- Accounting for dielectric constant, loss tangent, and other properties in simulations.
- Following fabrication constraints like trace spacing, hole sizes, impedance tolerances, etc.
- Planning for coefficient of thermal expansion.
- Managing thermal design for heat dissipation.
- Taking advantage of Rogers’ design resources and expertise.
Q: What are the main benefits of using PTFE-based Rogers materials?
Benefits of Rogers PTFE materials like RT/duroid 6000 include:
- Extremely low dielectric constant of 2.94 for better high frequency response.
- Very low loss for maximum signal integrity and minimal signal loss.
- Low Z-axis thermal expansion for reliability.
- High thermal conductivity for heat dissipation.
- Excellent dimensional stability.
- Good flexibility and drape characteristics.
Q: What types of testing and qualification is performed on Rogers materials?
Rogers subjects its materials to a variety of qualification testing:
- RF Testing – Measures dielectric constant, loss tangent, thermal coefficient of expansion and other RF parameters.
- Mechanical Testing – Evaluates tensile strength, compressive strength, shear strength, and more.
- Chemical Testing – Validates chemistry and assesses compatibility.
- Thermal Testing – Looks at thermal conductivity, continuous use temperature, and thermal shock resistance.
- Quality Testing – Dimensions, acceptability, hole quality, and visual characteristics.
- Reliability Testing – Assesses performance over time through accelerated testing.
- Qualification Testing – Evaluates suitability for stringent applications via prescribed standards.