The Rogers CuClad 6250 is polyethylene film with a pretty low melting point. Manufacturers hence use this bonding film to laminate strip lines and other multiple layer circuits. The Rogers CuClad 6250 boding film is not just handy as per its applications. It is also efficient and effective, which has led to its popularity in the tech market to date. But what properties make this bonding film unique? Which features make this bonding film stand out? And most importantly, is this bonding film worthwhile?
About the Rogers CuClad 6250 bonding film and why it is worth your while
Rogers CuClad 6250 bonding films are thermoplastic ethylene acrylic acid co-polymers. These bonding films bear features that make them great for bonding different dielectric structures such as glass and PTFE.
Using these bonding films, you can easily limit the amount of heat and pressure that strikes a specific component. So, pressure and heat-sensitive components maintain their stable form even under high heat or pressure.
Rogers CuClad 6250 bonding films come in two different variations. The sheeted form and the roll format, both of which are 21” (610 mm)
Rogers CuClad 6250 bonding film storage and shelf life
When you store the Rogers CuClad 6250 bonding film under perfect conditions, they do not have a limited life span. These ideal conditions include storage away from any direct sunlight, which could cause harm to the bonding films. In addition, storage in its original package, sealed, and at a temperature that is within 250C (that is 770F). And lastly also ensure that its storage environment does not surpass a relative humidity of 70%.
As per positioning, you should store the bonding film rolls suspended by roll cores or standing upright (on edge). In doing so, you avoid creating flat spots or creased areas due to the roll’s weight.
Features of the Rogers CuClad 6250 bonding films
The Rogers CuClad 6250 bonding film bears some features that make it stand out once you compare it with other bonding films. These features include:
- A Dielectric constant (Dk) of 2.32 – Rogers CuClad 6250 bonding films have a pretty low Dk, which hit only 2.32.
- A thickness of 0.0015” – Rogers CuClad 6250 bonding films have a thickness of 0.0015″, that is 0.038 mm. With this thickness, the Rogers CuClad 6250 bonding film is able to create a thick bond between different components. Combining this thickness with this bonding film’s low melting point feature, you get fascinating outputs as the net result.
- Impeccable tangent loss – Rogers CuClad 6250 bonding films have an impeccable tangent loss that stands at 0.0015 at a bandwidth of 10GHz.
- Impeccable melting temperature – Rogers CuClad 6250 bonding films have a resin melting temperature of 2130F. With this resin temperature melting point, this boding film is able to function even under extreme temperatures.
Benefits of utilizing the Rogers CuClad 6250 bonding films
If you are looking to use the Rogers CuClad 6250 bonding film on your Print Circuit board. Then here are some benefits that you are likely to reap:
- Low pressure and temp lamination – The Rogers CuClad 6250 bonding film provides pretty low temperature and pressure lamination. Their pressure and temp lamination is actually lower than that of a conventional thermoplastic RF film.
- Impeccable dielectric properties – These bonding films have dielectric properties that are incredible. Their dielectric properties are almost similar to those of a laminate system. They are hence mostly chosen for the bonding of multi-layer print circuit boards.
- Pressure-sensitive layers – These bonding film lets you attach layers that are pressure sensitive. You can hence include layers such as a dielectric foam layer.
- Impeccable electrical properties – Rogers CuClad 6250 bonding film has impeccable electrical properties. These properties help your PCB produce optimal outputs even with the bonding film in place.
- Reflow and remelting the bonding film – To reflow or remelt this bonding film, simply reheat it, and you are done.
Properties of the Rogers CuClad 6250 bonding films
Properties dictate the efficiency of a component. Hence, they are crucial to your choice of a bonding film or any other component.
Properties come in many different formats. For example, we have physical properties, mechanical properties, electrical properties, and so on.
The Rogers CuClad 6250 bonding film bears the following properties which make it stand out:
Physical properties
These are the properties that we measure without altering the bonding film’s chemical composition. These properties include:
Density
Under normal conditions, the density of the Rogers CuClad 6250 bonding films stands at:
- 0.930 g/cc
Thickness
The thickness property of the Rogers CuClad 6250 bonding film makes it stand out amongst other bonding films. Its thickness stands at a whooping:
- 0.0381 microns
Electrical properties of the Rogers CuClad 6250 bonding films
The Rogers CuClad 6250 bonding film has impressive electrical properties. These properties come in handy when utilizing this bonding film on Print Circuit boards.
Here are some electrical properties that make the Rogers CuClad 6250 bonding film stand out:
Volume resistivity
The Rogers CuClad 6250 bonding film bears the following volume resistivity:
- 1.00e + 16 ohm-cm
Dielectric constant
When you place the Rogers CuClad 6250 bonding film under a 1.00e + 10 Hz frequency. Its dielectric constant hits:
- 2.32
Dielectric strength
Under normal circumstances, the dielectric strength of the Rogers CuClad 6250 bonding film is:
- >= 39.4 kV/mm
Dissipation factor
When you place the Rogers CuClad 6250 bonding film under a temperature of 1.00e + 10 Hz. Its dissipation factor stands at:
- 0.0013
Arc resistance
The arc resistance of the Rogers CuClad 6250 bonding film under normal conditions stands within the range of:
- 130 to 140 sec
Thermal properties of the Rogers CuClad 6250 bonding film
During PCB assembly, the print circuit board and its components mostly undergo a lot of heating. Therefore attaching components with bad thermal properties could cause damage to the component or even the PCB.
However, this is not the case with the Rogers CuClad 6250 bonding film. These bonding films bear some remarkable thermal properties, which include:
Thermal conductivity
The Rogers CuClad 6250 bonding film has a thermal conductivity of:
- 0.170 W/m-K (under standard conditions)
Maximum service temperature
Under continuous use, the Rogers CuClad 6250 bonding film bears a maximum service temperature that is:
- <=75.0 0C
Brittleness temperature
The Rogers CuClad 6250 bonding film has a brittleness temperature that hits:
- -600C
Conclusion
The Rogers CuClad 6250 bonding films ensure efficiency and quality each time you utilize them. In addition, they boost your PCB’s performance and make PCB assembly easy to handle. Hence, if you are looking for a bonding film to use, you might want to try this one. The results might just surprise you.