The Rogers RO4835 Hybrid Multi-layer Board has become a popular choice with many manufacturers as they have improved their product’s flatness and accuracy of the board.
We can use this new design for several different purposes, and any attempt to factor in these benefits will explain how it functions. However, the primary benefit of this design is that the layers are close. It allows for minimal separation between the layers. The closer placement of the layers minimizes the amount of separation and reduces the risk of cracked layers.
Unfortunately, increased CTE leads to material warping and flexibility, which is not desirable in PC Boards. The smaller layer area minimizes this disadvantage by minimizing warping effects and yielding flexible yet easily bent board configurations.
The main disadvantage to this board is the difficulty in achieving higher layer accuracy. This deficiency is not due to design flaws but rather to inaccuracies in mechanical shifting when high layer counts are required.
Since these boards require less material, less copper is needed, which reduces weight and cost. Therefore, production costs go down by an amount directly related to copper weight.
The main advantage of the Rogers RO4835 Hybrid Multi-layer Board is that it is an extremely accurate board. This is because of its well-designed structure, which allows for a more resistant layer configuration.
Adding copper typically does not increase accuracy because the angles are around 0.0 degrees C. We can attribute this fact to the design of the Rogers RO4835 Hybrid Multi-layer Board.
Features
The Rogers RO4835 Hybrid Multi-layer Board represents a significant new development in PC Board construction and is no longer limited to specific parameters. As a result, Rayming PCB & Assembly use it for any application requiring accurate layer placement and zero CTEs.
High Tg FR4 Cores
CFR4 is a high-temperature and high-reliability material that holds up well in industrial applications. The Rogers RO4835 Hybrid Multi-layer Board utilizes this technology to create a more resistant board to cracking.
When the temperature exceeds the Tg point of FR4, the material becomes brittle. Because this technology can withstand temperatures up to 1500C, we can use it for PCBs with minimal warping of the layers. It offers excellent resistance to thermal fatigue and does not lose its properties or properties at elevated temperatures.
Low Tg FR4 Prepreg
This is a process that companies use to reduce the density of the board and increase its flexibility. We can apply this technology to the Rogers RO4835 Hybrid Multi-layer Board. The result is a board that holds up well to flexing and bending.
The Rogers RO4835 Hybrid Multi-layer Board offers about 40% more flexibility than standard boards due to this extra density reduction and increased surface area. As a result, the board can be bent and flexed, making it easier to handle during assembly.
Adhesive Free Laminate
This is a special type of bonding technology that involves using an adhesive to join laminated boards together. This process allows for a thicker laminate that increases material strength and durability. The result is that this process further improves the performance of the Rogers RO4835 Hybrid Multi-layer Board by increasing its resistance to warping in high-temperature environments and effectively maintaining its properties at elevated temperatures.
Balanced RO4835 Layers
Also known as Multi-Layer Boards, this new construction method allows for more layers in the same amount of space. This design feature helps increase accuracy and reduce CTEs in the layers.
This board structure also reduces warping and increases flexibility due to its improved design.
The Rogers RO4835 Hybrid Multi-layer Board utilizes this technology to allow for more layers and reduces the number of layers needed by about 15% compared with standard multi-layer boards.
Metal Distribution
This is a new technique that allows for increased flexibility in the layers. This method has been used on the Rogers RO4835 Hybrid Multi-layer Board to increase accuracy and reduce layer separation.
This new design greatly reduces warping by increasing the vertical force exerted on each layer, making it easier to get accurate results. In addition, the vertically applied pressure ensures that each layer remains flat during production and assembly.
The metal shim increases resistance to thermal fatigue and overall bending by increasing metal mass in the laminate.
Reduced Ramp Rate to Temperature
This new process results in more accurate board dimensional control used to achieve better layer to layer separation. The Rogers RO4835 Hybrid Multi-layer Board uses a ramp rate of 10C/min and keeps the temperature above the glass transition temperature (Tg).
This method reduces warp due to thermal fatigue and maintains high accuracy due to reduced thermal gradients.
Step-Down Pressure Profile
This is a new technique used in Rogers RO4835 Hybrid Multi-layer Boards production. It uses a ramp rate of 10C/min, keeping the temperature above the glass transition temperature (Tg).
The results are more accurate boards, requiring fewer layers and offering better dimensional control. In addition, this method uses pressure profiles that produce better quality output while reducing warping and enabling thinner board constructions.
Pre-Baked RO4835 Cores
This technology is helpful in the production of Rogers RO4835 Hybrid Multi-layer Boards. It allows for better dimensional control and reduced warping due to its use.
This process involves using a temperature of 100C and a ramp rate of 10C/min. This method increases stability, consistency, and accuracy compared with the previously used Rogers RO4835 Hybrid Multi-layer Board manufacturing processes. In addition, this process allows for boards that are more resistant to thermal fatigue and further increases overall accuracy.
Post-Process Flattening
This method helps to increase accuracy and reduce warping. It involves using a temperature of 100C in combination with a ramp rate of 10C/min.
This process was used as part of the Rogers RO4835 Hybrid Multi-layer Board manufacturing process to increase thermal stability and reduce warping. In addition, this method allows for better dimensional control, greater accuracy, reduced mass loss, and fewer CTEs.
Benefits
1. Large, One-Step Process Increases Flexibility
This new process allows for better dimensional control and reduced warping due to its use.
This new design greatly reduces warping by increasing the vertical force exerted on each layer, making it easier to get accurate results. In addition, the vertically applied pressure ensures that each layer remains flat during production and assembly.
2. Improved design flexibility
This technology allows for more layers in the same amount of space. This technology has been used on the Rogers RO4835 Hybrid Multi-layer Board to increase accuracy and reduce CTEs in the layers.
This board structure also reduces warping and increases flexibility due to its improved design
3. Minimizes local variation of dielectric constant
This technology produces more accurate boards, requiring fewer layers and better dimensional control.
This method uses pressure profiles that produce better quality output while reducing warping and enabling thinner board constructions.
4. Ease of PCB manufacturing and assembly in line with FR-4
This board structure also reduces warping and increases flexibility due to its improved design.
This process results in more accurate board dimensional control to achieve better layer-to-layer separation.
This technique uses a temperature of 100C combined with a ramp rate of 10C/min. This method reduces warp due to thermal fatigue and maintains high accuracy due to reduced thermal gradients. It involves using a temperature of 100C in combination with a ramp rate of 10C/min.
5. CAF resistant
This new process uses a ramp rate of 10C/min, keeping the temperature above the glass transition temperature (Tg). The results are more accurate boards, requiring fewer layers and offering better dimensional control.
This method produces boards that are more resistant to thermal fatigue and further increase overall accuracy.
Conclusion
The Rogers RO4835 Hybrid Multi-layer Board is a multi-layered copper PCB made of FR-4.
This board structure is essential in Rogers RO4835 Hybrid Multi-layer Boards production, which allows for greater thermal and electrical performance.
The Rogers RO4835 Hybrid Multi-layer Board provides digital signal integrity by reducing signal reflection and signal loss. It offers two layers on a single PCB to reduce mass and costs simultaneously.
