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HDI – High Density Interconnect PCB

Rayming HDI Capability: 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer connect, R&D Support

High Quality high-density interconnect PCB Manufacturing, blind via or/and buried hole, accept any layer of the PCB to be interconnected freely.



High density interconnect (HDI) PCBs enable denser routing, finer lines and spaces, smaller vias, and more layers than conventional PCBs. They are essential for miniaturized and high performance electronics like smartphones, wearables, IoT devices, automotive electronics, and medical devices.

Selecting the right HDI PCB manufacturer is crucial to get high yields, quality, and timely delivery for prototyping and volume production. This article provides a comprehensive list of the top 18 HDI PCB manufacturers across the globe along with a framework for comparing their capabilities and selecting the optimum partner.

Overview of HDI PCBs

HDI refers to the use of microvias (smaller than traditional vias) to interconnect layers in a PCB. This allows greater routing density. Some key features:

  • Trace/space: ≤ 100 μm (3.9 mils)
  • Microvias: ≤ 150 μm with ≥ 20:1 diameter to hole ratio
  • Thin dielectric layers: ≤ 60 μm
  • More layers: > 10 layers
  • Finer pad geometries
  • Tighter pitch components: 0201, 01005 discretes, BGAs

Benefits of HDI technology:

  • Miniaturization – More compact PCBs
  • Higher speeds – Tight impedance control
  • Routing channels – Solve high density routing
  • Layer count – Complex designs with 30+ layers
  • Higher component densities
  • Noise isolation – Separate analog and digital

HDI PCBs require specialized manufacturing processes and equipment. Not all standard PCB manufacturers have HDI capabilities.

Top 18 HDI PCB Manufacturers

1. RayMing Technology

Rayming is 18 years HDI PCB manufacturer,

HDI PCB Manufacturing Capabiltiy : 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D.

Founded in 2005 and headquartered in Shenzhen, China, RayMing has established itself as a leading manufacturer of HDI, rigid-flex, and specialized PCBs. Some key facts:

  • 7 manufacturing sites across China
  • Employs over 5000 staff
  • ISO 9001, ISO 14001, ISO 45001 certified
  • IATF 16949 certified facilities
  • Reliability testing – IST, HAST, thermal shock/cycling

RayMing provides a one-stop shop from design support and quick-turn prototyping to high volume manufacturing of HDI, rigid-flex, aluminum, and RF PCBs. They serve customers globally across telecom, auto, industrial, medical, aerospace, and instrumentation sectors. Known for technical expertise at solving complex PCBs using HDI, buried/blind vias, and advanced multilayering.

HDI PCB stackup

2. TTM Technologies

TTM Technologies is a leading PCB manufacturer with revenues of $2.2 billion and 16,000+ employees worldwide. Their offerings include:

  • HDI layers: >30 layer
  • Line width/spacing: 3/3 μm
  • Microvias: 80 μm, 60 μm capable
  • Via in pad, buried and stacked vias
  • Sequential lamination
  • Any-layer-HDI

TTM utilizes advanced processes like modified semi-additive (MSAP) to achieve high yields on fine line HDI and rigid-flex PCBs for smartphones, networking gear, aerospace, defense, and automotive applications.

3. AT&S

AT&S is Europe’s largest PCB manufacturer and a leading global producer of HDI boards and IC substrates. The Austria-based company operates plants in India, China, Korea, and Austria.

Key capabilities for HDI PCBs:

  • Trace/space: ≤ 5/5 μm
  • Microvias: 50 μm
  • Laser drilling down to 15 μm diameter
  • Build-up layer on both sides
  • RDL layers on IC substrates
  • Flip chip and wafer level packaging

AT&S focuses on high-end PCB technologies for applications like 5G equipment, automotive radar, and advanced driver assist systems (ADAS). Other areas of expertise include automotive, industrial, and medical PCBs.

Optical Module Testing PCB

4. Tripod Technology

Tripod Technology is one of the largest PCB manufacturers in Taiwan with revenues of over $1 billion. The company has HDI capabilities across multiple facilities:

  • Build-up layers: Max 36 layers
  • Line width/space: 3/3 μm
  • Thickness tolerance: ±10%
  • Microvias: 80 μm, 70 μm capable
  • Pad size: 70 μm minimum

Tripod specializes in producing ultra-thin, high-precision HDI boards using MSAP for customers serving the communications, networking, automotive electronics, and consumer wearables segments.

5. Unimicron Technology

Headquartered in Taiwan, Unimicron is a global leader in HDI substrates for mobile chips, RF PCBs, IC substrates, and rigid-flex PCBs used in smartphones, laptops, smartphones, wireless gear, automotive infotainment, and portable electronics.

Unimicron operates numerous advanced HDI facilities:

  • Line width/space: 2/2 μm
  • Microvias: 60 μm
  • Stacked microvias
  • Thin core handling down to 25 μm
  • Plated through holes (PTH): 150 μm
  • High TG materials
  • Sequential lamination -ALIVH (any layer interstitial vias)

Known for expertise in densely packed HDI flex-rigid boards using staggered microvias for wearables and mobile devices.

6. Zhen Ding Tech

Zhen Ding Tech is a major flexible circuit board manufacturer headquartered in Taiwan with over $2 billion in revenues. Zhen Ding has ramped up investments in HDI and substrate production over the past decade. They provide:

  • Over 36 layers
  • Blind and buried vias
  • Microvias: 60 μm
  • Thin laminates down to 12.5 μm
  • Flex-on-flex multilayers
  • Flexible substrates

ZD Tech produces billions of HDI PCBs annually for automotive electronics, next-gen smartphones, AR/VR devices, and advanced chip packaging. Other capabilities cover chip-scale packaging and wafer level processes.

HDI Pcb structure

7. Ibiden

Japan based Ibiden has over $5 billion in revenues and manufacturing sites in Japan, Malaysia, Singapore, Germany, and USA. It is a major supplier of build-up MLBs and HDI packaging substrates to semiconductor firms.

Key HDI capabilities include:

  • Build-up layers: >20 layers
  • Blind/buried vias
  • Microvias down to 40μm
  • Copper filled vias
  • Laser via drilling at 50 μm
  • Thin cores up to 35 μm
  • Flexible multilayers
  • High density chip packaging

Ibiden focuses on cutting-edge PCB technologies for 5G infrastructure, artificial intelligence, HPC, automotive, aerospace applications.

8. Samsung Electro-Mechanics

Samsung Electro-Mechanics is the PCB manufacturing division of the Korean electronics giant Samsung Group. While best known for multilayer boards for smartphones, Samsung has advanced HDI PCB capabilities:

  • Build-up layers: 18~36 layers
  • Line/space: 2/2 μm
  • Microvias: 50 μm
  • Interposers
  • Rigid-flex
  • High layer FC substrates
  • IC substrates with >700 IOs

SEM’s phased investment of over $600 million in HDI facilities provides boards and substrates for Samsung’s IT equipment, mobile processors, and other component businesses.

HDI any-layer connect printed circuit boards are the next technological enhancement of HDI microvia PCBs: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these HDI PCBs, RayMing uses laser-drilled microvias electroplated with copper.

HDI Board

9. Compeq Manufacturing

Compeq Manufacturing is a major PCB producer headquartered in Taiwan with plants in China/Vietnam serving high-end networking, computing, and communications customers.

Their advanced HDI plant offers:

  • Build-up layers: >12 layers
  • Line/space: 2/2 μm
  • Microvias: 60 μm
  • Stacked microvias
  • Blind/buried vias
  • Thin cores down to 35 μm
  • Rigid-flex

Compeq is a key supplier of high layer count boards for data center servers and networking infrastructure demanding leading edge PCB technologies.

10. Wus Printed Circuit

Wus Printed Circuit is a public Chinese PCB manufacturer with annual revenues of over $1 billion. Their HDI capabilities include:

  • Build-up layers: As high as 36 layers
  • Line/Space: 3/3 μm
  • Microvias: 60 μm
  • Copper filled vias
  • Via in Pad (VIP)
  • Thin cores down to 35 μm

Wus uses laser direct imaging to produce high density HDI and SLP substrates for smartphone APs, laptops, automotive electronics, base stations, and data center hardware.

6 layer blind via hole hdi pcb
6 layer Blind via hole HDI PCB

11. Shenzhen Kinwong

Founded in 1992, Kinwong is one of the largest PCB producers in China with global sales exceeding $800 million across seven plants. Kinwong has invested in advanced HDI lines:

  • Build-up layers: >20 layers
  • Line/space: 2/2 μm
  • Microvias: 60 μm
  • Thin cores down to 25 μm
  • Laser microvia drilling

Kinwong supplies multilayer boards to top telecommunications, industrial electronics, auto infotainment, smartphone, and wearables OEMs.

12. Dynamic Electronics

Dynamic Electronics is a manufacturer of HDI, rigid-flex, and RF PCBs based in Thailand. They offer:

  • Build-up layers: Up to 20 layers
  • Line/space down to 3/3 μm
  • Microvias: 80 μm, 65 μm
  • Blind/buried vias
  • Flexible multilayering
  • Aluminum on flex

Dynamic uses modified semi-additive and subtractive processes to produce complex HDI. Their key end markets include aerospace, defense, industrial, and medical applications.

13. CMK Corporation

CMK Corporation is a Japanese PCB manufacturer specializing in IC substrates, fine pitch boards, and 2.5/3D packages.

Their HDI capabilities cover:

  • Build-up layers: >20 layers
  • Line/space: 5/5 μm
  • Microvias: 60 μm
  • Thin cores down to 50 μm
  • Blind/buried vias
  • Flexible multilayers
  • Flip chip bonding

CMK focuses primarily on HDI boards for semiconductor IC packaging and high density wire bonding.

14. Nan Ya PCB

Nan Ya PCB is a Taiwan based manufacturer of laminates, prepregs, copper clad laminates. Its PCB division offers advanced HDI boards:

  • Build-up layers: >10 layers
  • Lines/spaces: 3/3 mils (capable of 2/2 μm)
  • Microvias: 80 μm and below
  • Copper filled vias
  • Blind/buried vias
  • Thin cores

Nan Ya produces rigid, flex, and rigid-flex HDI PCBs for automotive electronics, servers, base stations, routers, switches, and other networking gear.

15. Shinko Electric

Headquartered in Japan, Shinko manufactures HDI PCBs, IC substrates, and semiconductor packages. They provide:

  • Build-up layers: Up to 20 layers
  • Line/space: As tight as 15/15 μm
  • Microvias: 60 μm
  • Thin cores down to 30 μm
  • Laser drilling at 35 μm
  • Blind and buried vias

Shinko services customers in computing, communications infrastructure, automotive infotainment and ADAS applications.

8 layer RF PCB blind hole Board

16. Fujikura

Fujikura is a Japanese manufacturer of flexible printed circuits with revenues exceeding $1.3 billion. Their flexible HDI capabilities include:

  • Build-up layers: 6 to 8 layers
  • Blind vias and microvias
  • Flex-on-flex multilayering
  • Rigid-flex integration
  • Roll-to-roll mass lamination

Fujikura flex circuits find applications in consumer electronics, automobiles, robotics, medical devices. Their expertise lies in high-mix, flexible HDI production.

17. Flexium Interconnect

Flexium is a leading Taiwanese manufacturer of flexible PCBs with revenues of approximately $1 billion. They possess advanced flex HDI manufacturing capabilities:

  • Build-up layers: 8 layers
  • Blind vias
  • Thin flexible multilayering
  • Roll-to-roll processing
  • Laser via ablation

Flexium supplies flex and rigid-flex boards for dynamic flexing applications in smartphones, laptops, consumer electronics, wearables, VR/AR devices.

18. Flex International

Flex International provides comprehensive flex PCB fabrication and assembly. Their flexible HDI capabilities include:

  • Build-up layers: 6 to 10 layers
  • Blind and buried vias
  • Laser microvias down to 25 μm
  • Thin cores down to 25 μm
  • Flex-rigid-flex integration
  • Quick turnaround prototypes

Flex International produces custom flexible circuits boards for medical, industrial, aerospace, and defense industry customers.

Comparing HDI PCB Manufacturers

Here are some key factors to consider when selecting an HDI partner:

Technical Capabilities

  • Finest line width/spacing – 2 μm or lower is preferred
  • Microvia size – 50 μm to 80 μm range
  • Number of HDI build-up layers – >20 layers ideal
  • Thin core handling – 25 μm to 35 μm range
  • Laser drilling diameters – Below 50 μm
  • Blind and buried vias for dense interconnects
  • Stacked or staggered microvias

Quality & Reliability

  • IPC 6012 Class 3 and Class 3A certification for HDI
  • Robust quality processes – AOI, test, inspection, statistical process control
  • Reliability testing – IST, HAST, drop/shock/vibration

Volume Production

  • Monthly capacity – Number of panels per month
  • Consistent on-time delivery metrics
  • Years of experience with mass HDI production

Customer Service

  • Technical expertise providing layout reviews and DFM feedback
  • Response time for quotations, samples, inquiries
  • Supply chain transparency and reporting
  • Customer reviews and testimonials


  • HDI pricing – may vary based on complexity, layer count
  • NRE charges for prototyping
  • Budgetary estimates before design finalization


  • Production sites close to key customers
  • Global footprint for production redundancy

Carefully evaluating manufacturers against these criteria simplifies selection of the ideal HDI partner.


8 layer Hdi PCB
8 layer Hdi PCB

HDI PCB technology enables miniaturized electronics design through high density interconnects, fine features, and thin materials. As products become thinner and lighter, HDI provides the means to pack more functionality and components into tight spaces. Partnering with specialized manufacturers that have invested in advanced HDI capabilities and processes is crucial to realize the benefits of next-gen PCB technologies. This article provided an overview of the top 18 HDI PCB manufacturers globally and a framework to match specific product needs with the right manufacturing partner. The key is early supplier engagement to understand capabilities and limitations before finalizing designs. Investing upfront in DFM and manufacturability will ensure high yields and repeatable quality when transitioning to volume HDI production.


What are some key differences between HDI and conventional PCBs?

HDI PCBs use smaller microvias rather than traditional vias to interconnect layers. They allow finer traces and spaces, thinner dielectric materials, higher layer counts, and greater component densities versus standard PCBs.

What are the typical applications for HDI PCBs?

HDI PCBs are commonly used in space constrained and high performance products like smartphones, wearables, medical devices, auto electronics, aerospace avionics, 5G infrastructure, and other advanced electronics.

What are the typical lead times for prototype vs production HDI PCBs?

HDI PCB prototype lead times range from 24 hours to 2 weeks depending on complexity. Volume production lead times are usually around 4 to 8 weeks once the design is finalized.

Does HDI improve signal speeds compared to conventional PCBs?

Yes, the thinner dielectrics, dense interconnects, and impedance control offered by HDI technology allows faster signal propagation which improves high speed capabilities.

What are the main challenges in manufacturing HDI PCBs?

Tight process controls and special equipment are required to produce fine features and thin materials consistently. Handling thin cores without distortion and high yields on microvias require considerable expertise. Testing and inspection regimes must also validate the high density interconnects across layers.