Layer: 4 Layer PCB
Thickness: 1.6mm
Size: 200x150mm
Rogers 4003c datasheet
RO4000 Laminates RO4003C and RO4350B – Data Sheet
What is Rogers 4003?
Rogers 4003 is a ceramic-filled, woven glass reinforced hydrocarbon/ceramic laminate material specifically engineered for high-frequency and high-speed digital applications. This material offers exceptional electrical properties, making it an ideal choice for applications operating at frequencies ranging from DC to millimeter-wave frequencies.
Key Features of Rogers 4003
| Feature | Value |
|---|---|
| Dielectric Constant (εr) at 10 GHz | 3.38 ± 0.05 |
| Dissipation Factor (tan δ) at 10 GHz | 0.0027 |
| Thermal Conductivity (W/m/K) | 0.71 |
| Coefficient of Thermal Expansion (ppm/°C) | 17 (x, y), 24 (z) |
Rogers 4003 boasts a low dielectric constant and dissipation factor, ensuring minimal signal loss and excellent electrical performance at high frequencies. Additionally, its thermal conductivity and coefficient of thermal expansion make it suitable for applications where thermal management is a critical concern.
4 Layer 1.6mm Rogers 4003 Circuit Board
The 4 Layer 1.6mm Rogers 4003 Circuit Board is a multilayer PCB construction that combines the exceptional properties of Rogers 4003 with a robust four-layer stackup. This configuration offers numerous advantages for high-frequency and high-speed digital applications.
Advantages of a 4 Layer Stackup
- Increased Routing Density: With four conductive layers, the PCB offers greater routing density, allowing for more complex designs and higher component integration.
- Improved Signal Integrity: The additional layers provide better control over impedance matching, reducing signal reflections and ensuring reliable high-speed signal transmission.
- Power and Ground Plane Separation: The dedicated power and ground planes in a 4 layer stackup minimize noise and interference, ensuring a clean power distribution and improved signal quality.
- Thermal Management: The additional layers and the thermal conductivity of Rogers 4003 contribute to better heat dissipation, enhancing the overall thermal performance of the circuit board.
Applications of 4 Layer 1.6mm Rogers 4003 Circuit Board
The 4 Layer 1.6mm Rogers 4003 Circuit Board finds applications in a wide range of industries and applications, including:
- Wireless Communications (5G, LTE, WiFi, Bluetooth)
- Radar Systems
- Satellite Communications
- Automotive Radar and Communication Systems
- Aerospace and Defense Electronics
- Test and Measurement Equipment
Design Considerations
When designing circuits on the 4 Layer 1.6mm Rogers 4003 Circuit Board, several factors should be taken into consideration:
- Controlled Impedance: The low dielectric constant and consistent electrical properties of Rogers 4003 allow for precise impedance control, ensuring signal integrity at high frequencies.
- Thermal Management: Proper thermal management techniques, such as the use of thermal vias and heat sinks, should be employed to effectively dissipate heat generated by high-power components.
- Stackup Design: The layer stackup should be carefully designed to optimize signal routing, minimize cross-talk, and ensure proper power and ground plane distribution.
- Manufacturing Considerations: The design should take into account the manufacturing capabilities and limitations of the PCB fabrication process, including minimum feature sizes, drill sizes, and surface finish requirements.
