You’ve come to the right place if you’ve been looking for information on the high-frequency laminate, Rogers RT/DUROID(r) 6202PR. This article covers everything you need to know about this laminate and what it can do for your electronics.
Rogers RT/duroid(r) 6202PR high-frequency laminate
RT/duroid(r) 6202PR high-frequency laminate is a ceramic-filled PTFE composite material specifically designed for RF and high-power applications. Its thermal conductivity (CTE) is 2.4 times higher than standard RT/duroid 6000 products. It makes it an exceptional choice for high-power applications. Rayming PCB & Assembly provides RT/duroid6202PR laminates available in ENIG, HASL, and bare copper versions.
RT/duroid 6202PR laminate is ideal for high-frequency and ultrahigh-frequency applications. This material combines good electrical, mechanical, and thermal properties with low dielectric loss. Its low dimensional stability reduces the risk of circuit degradation, and it enables high-frequency circuitry reliability. In addition, its limited woven glass reinforcement eliminates double etching and minimizes tool wear.
RT/duroid 6202PR high-frequency laminate has similar TCDk characteristics to LNAs and PAs, and it maintains consistent Dk behavior in the same way as copper. As a result, it is suitable for high-frequency applications and guarantees reliable plated through holes. Furthermore, this material is compatible with most circuit materials. Therefore, in addition to high-frequency applications, it is also ideal for use in radar and automotive systems.
RF/microwave applications require accurate modeling of a material’s dielectric constant (Dk). We can calculate the Dk value of a material from its design Dk. The design Dk is a more accurate estimate of the dielectric constant. The MWI-2010 Microwave Impedance Calculator and the Product Selector Guide include Dk values for high-frequency applications.
RT/duroid(r) 6202PR materials
The Rogers RT/DUROID 6202PR high-frequency laminate offers excellent dimensional stability, a low thermal conductivity, and a dielectric constant in the z-axis (Tgof) of 3.5 when at 10 GHz. Its properties make it ideal for high-frequency multilayer circuits. The material is also available with electrodeposited copper foil that is reverse-treated.
The RT/DUROID 6202PR high-frequency circuit material features ceramic-filled PTFE laminates designed for use in RF and microwave applications. They have exceptional thermal conductivity, with a Dk value of 2.94, almost twice that of standard RT/DUROID 6000 products. These laminates also have good drill-ability, thanks to a sophisticated filler system.
The RT/DUROID 6202PR incorporates the latest advancements in technology. Its ultra-thin, airborne design allows for use in various environments, including airports. Its low weight makes it ideal for airborne satellite applications. Moreover, its high-quality coatings can withstand temperatures up to -40°C. These features make it an excellent choice for any commercial or domestic application.
RT/duroid(r) 6202PR high-frequency laminate features
The high-frequency laminate provides superior electrical and mechanical properties that enable engineers to construct substrates efficiently. The Rogers RT DUROID 6202PR features an extremely low dielectric constant and is well-suited for high-frequency applications. Its low dielectric constant allows for repeatability in manufacturing and processing, making it an excellent choice for high-frequency RF circuitry.
At the European Microwave Week, there were highlights on a range of materials solutions, including RT/duroid 6202PR high-frequency laminate, RO4003C, and RO4350B. These laminates are available with enhanced copper bond technology, allowing cost-effective circuit solutions and reduced passive intermodulation distortion. In addition to high-frequency materials, Rogers will also exhibit its thin RT/duroid 8000 circuit laminates and TMM laminates.
Another important application for the Rogers RT DUROID 6202PR is in radar systems. This system is essential in aircraft to detect targets at long range. A high-frequency laminate offers excellent sensitivity, low loss, and outstanding dimensional stability. Its high-frequency performance allows for the design of complex microwave structures. In addition to high-frequency performance, it is durable, reliable, and offers excellent dimensional stability.
Besides the RT DUROID 6202PR, Rogers will showcase its complete range of high-frequency laminate materials at DMC 2010. They will showcase the latest high-frequency XT/duroid 8000 and RT/duroid 8100 laminate materials. Both high-frequency laminate materials are compatible with ULTRALAM 3908 bondply and many other material systems.
Rogers RT/duroid 6202PR has outstanding dimensional stability and a low dissipation factor. As a result, this laminate is ideal for antennas and multilayer circuits that require a high-frequency frequency. For example, a TGOF of 1.96 at 10 GHz offers unmatched stability with low losses and a dissipation factor of 30 ppm/degC in the z-direction.
Application
The RT/Duroid 6202PR high-frequency laminate is helpful in high-frequency applications such as active and passive electronic circuits, multilayer circuit structures, filters, and RF structures.
Because it has low Tg, the 6202PR provides a cost-effective solution for microwave applications. It is suitable for high-frequency applications that require thin laminates and excellent thermal stability. When paired with a glass cloth dielectric, it is ideal for power divider circuits used in radar systems.
Advantages
The RT/Duroid 6202PR high-frequency laminate is easy to fabricate by conventional microwave technology and has good mechanical properties, making it a good choice for high-frequency applications. In addition, the thermal conductivity (approximately 0.9 W/mK) is higher than that of most other available materials.
The RT/Duroid 6202PR has a high dielectric constant and low dissipation factor, suitable for high-frequency applications such as multilayer circuit structures and filter designs.
The RT/duroid 6202PR is a flexible, thin (less than 1 mm), multilayer, high-frequency laminate that’s easy to fabricate. As a result, a circuit designer can use it for prototype building. In addition, it is available in the form of standard off-the-shelf sizes, which further simplify its use.
The material is well-suited for designs requiring high dielectric constant and low dissipation factor. We also use it in narrowband filters and multilayer circuit structures.
The RT/Duroid 6202PR is a high-frequency laminate (1–8 GHz) composed of ceramic-filled PTFE with a Tgof of 3.5 and a loss tangent of 0.0048.
The Rogers Duroid 6202PR is available in 1 mm thickness and with either film or foil adhesive. A standard circuit thickness is 1 µm (0.001 in). The standard finished size is 1016mm x 2025mm. However, we can make it in other sizes.
Disadvantages
The RT/Duroid 6202PR has a high dielectric constant and good thermal conductivity but a low dissipation factor. As a result, it is not well-suited for passive infrared applications because of its relatively high Tgof.
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The RT/Duroid 6202PR high-frequency laminate is well-suited for RF designs in RF vacuum tube radio amplifier circuits due to its low dissipation and dielectric constant. Furthermore, its high-frequency performance allows for complex microwave structures. In addition to high-frequency performance, it is durable, reliable, and has excellent dimensional stability.
Rogers RT/Duroid 6202PR high-frequency laminate is a reliable material that offers good performance at frequencies 1 GHz to 10 GHz. In addition, the copper bond technology and film or foil adhesive provide flexibility and aesthetics.
The RT/Duroid 8100 laminate’s close TGOF of 1.9X allows the design of complex microwave structures, such as mobile phone base stations, scanners, and waveguide elements, with a significant gain.
Conclusion
Rogers RT/Duroid 6202PR high-frequency laminate is a reliable, cost-effective laminate material that works well at frequencies 1 GHz to 10 GHz. It is easy to fabricate by conventional microwave technology. It has good mechanical properties allowing it to help in high-frequency applications such as RF vacuum tube radio amplifier circuits. In addition, a circuit designer can use it for prototype building and other functions.
