Integrated circuits are an integral part of electronic devices. These circuits are commonly found in modern devices. They are responsible for the compactness of electronic devices. Integrated circuits are the heart of most printed circuit boards. These ubiquitous black chips are available on almost every printed circuit board.
At least one IC is available in every electronics. ICs comprise a collection of components such as capacitors, diodes, transistors, etc. These components are all included in a tiny chip, which is the IC. Also, these components are connected together to help the electronic device function as expected. Integrated circuits have several types of packages. Examples of these packages include SOIC, SSOP,TSSOP, and more.
What is the SOIC Package?
SOIC package is a type of surface mount integrated circuit that has a rectangular body with leads protruding from two sides. The small outline integrated circuit (SOIC) package has one of the easiest SMD parts that can be soldered. Each pin on an SOIC package has a space of about 1.27mm from the next.
The leads of the SOIC package are in a gull wing shape that enables footing during PCB assembly. Due to the benefits and features of SOIC, it is one of the most commonly used SMT IC packages today. One of the benefits of this package is that it is JEDEC compliant. Also, this package is available in various body widths. The most popular body width is 3.8mm or 150 mils.
However, the standard lead pitch for SOIC package is 50 mils or 1,27mm. This IC package is usually shipped in reel and tubes. SOIC is available in various types which include the small outline J-leaded packages (SOJ), the small mini outlines package (MSOP), the shrink small outlines packages (SSOP), and the small thin outline integrated circuit package (TSOP).
These variants come with different structural measurements. However, the SOIC features 1.25mm lead spacing . SOIC is standardized and regulated in order to make installment an easy process. This IC package comes with package information that has a prefix SO. The number after the prefix is the pin count of the particular integrated circuit.
The small outline integrated circuit package is shorter than the dual inline package (DIP). It is a surface mount IC package with its DIP bins shrunk down to a smaller size. SOIC has an exposed pad which helps to improve heat dissipation more than a standard TSSOP. This helps to increase the operating parameters’ margin.
What are the Advantages of the SOIC package?
SOIC offers a lot of advantages. Compared to other IC packages, SOIC provides more benefits. The most significant benefit of SOIC is the footprint reduction. This is because space reduction helps in fabricating smaller printed circuit boards. Also, SOIC minimized the cost of fabricating integrated circuits since the materials used in the packaging are reduced.
With the small outline IC package, it is easy to access small size components by a machine during PCB assembly. This IC package makes the fabrication of multilayer boards very easy since it is a surface mount IC package type. Another advantage of SOIC is that it is suitable for applications where low-cost solutions are required.
Furthermore, SOIC package makes use of at least 0.50-inch lead spacing. This helps to ensure the pins or leads have enough spacing.
Features of SOIC Package
- It features gull wing lead configuration
- Multilayer ceramic package
- Comes with footprint similar to plastic SOP
- The leads of SOIC are gold plated
- It is a type of surface mount package with .050 inches as its lead spacing
- SOIC is available in a few variants.
- The pin sizes and package size of SOIC have references
- SOIC comes with an identical pinout
SOIC Standards
The SOIC package is ideal for use in different applications. SOIC package makes use of the JEITA and JEDEC standards. However, it is quite confusing to decide which of these standards are better. JEITA is a standard set up by the Japanese trade organization to evaluate the performance of specific electronic s and the IT industries.
JEDEC, on the other hand, regulates the activities of the semiconductor market. It oversees the standardization of semiconductor part numbers and the Electrostatic Discharge (ESD) standard. The best way to differentiate between JEITA and JEDEC SOIC is the sizes. JEITA SOIC is smaller and lighter than JEDEC SOIC.
Also, the JEDEC standard is popularly used for manufacturing SOIC in the U.S while JEITA is a standard set up and used for manufacturing SOIC in Japan.
SSOP Meaning: What is SSOP Package?
The SSOP package is a variant of SOIC package. The shrink small-outline package, popularly known as SSOP is a smaller type of SOIC package. It integrates SMT in packaging integrated circuits. This variant of SOIC is suitable for applications where optimum performance is crucial in IC packaging that has tightened lead pitch.
The body size of SSOP is usually compressed to get a smaller version of SOIC. Also, the lead pitch of SSOP is also tightened to achieve this smaller version. The lead counts of SSOP is within the range of 8 to 64. Its body size ranges from about 209 to 300 mils. One of the benefits of this IC package is that it complies with standards like EIAJ and JEDEC.
This IC package offers a significant reduction in terms of size while providing low-cost and value-added solutions for various applications. The gull-wing leads of SSOP are extending from its longer sides. You will find SSOP in end-products like disc drivers, RDF devices or components, radio, and telecom. This compact IC packaging option comes with a lot of benefits which include improved electrical performance and better heat dissipation.
Furthermore, SSOP has solder plated leads which helps to ensure excellent performance when used in some applications. SSOP package features leads in both sides of periphery. Also, the lead pitch of this SSOP is less than 1.0mm.
Features of SSOP
- The tube quantity varies
- The parts of this package are available on reel and tape according to request
- Its body widths ranges from 209 to 300 mils
- The copper lead frames have high conductivity
- Also, its moisture sensitivity complies with JEDEC level 3
- Multi-die production capability
- The leadframe strips have higher density
- Comes with standard JECEC package outlines
SOIC vs SSOP Package
SOIC package is a type of surface mount integrated circuit that has a rectangular body with leads protruding from two sides. The small outline integrated circuit (SOIC) package has one of the easiest SMD parts that can be soldered. Each pin on an SOIC package has a space of about 1.27mm from the next.
The SSOP package is a variant of SOIC package. The shrink small-outline package, popularly known as SSOP is a smaller type of SOIC package. It integrates SMT in packaging integrated circuits. This variant of SOIC is suitable for applications where optimum performance is crucial in IC packaging that has tightened lead pitch.
The major difference between these IC packages is in their size and the spacing between their leads. SOIC features 1.25mm lead spacing. Each pin on an SOIC package has a space of about 1.27mm from the next. The lead pitch of this SSOP is less than 1.0mm. On the other hand, standard lead pitch for SOIC package is 50 mils or 1,27mm.
When comparing SOIC vs SSOP package, you will realize some similarities between these two packages. This is because the SSOP package is a smaller version of SOIC. Therefore, there are a few similarities these packages share. SOIC vs SSOP compares the features, advantages, and applications of these packages.
TSSOP Vs SSOP
TSSOP means thin shrink small outline package. This variant of SOIC integrates surface mount technology to package integrated circuits. TSSOP provides an efficient solution for installing ICs on PCBs. TSSOP looks like a flat rectangular IC die fixed to a lead frame encapsulated in plastic material. Also, the lead frame comprises elongated pins or leads arrange along a package’s perimeter.
From its name, TSSOP is a thin variant of SOIC. The thin profile of this IC package enables greater density on a circuit board. Furthermore, TSSOP is more compact and thinner than other IC packages or SOIC variants. Due to the space-saving feature of TSSOP, this IC package is an ideal option for applications where functionality and high level integration is needed in a limited space.
Although the SSOP package is a variant of SOIC package, TSSOP is more compact than it. The shrink small-outline package, popularly known as SSOP is a smaller type of SOIC package. It integrates SMT in packaging integrated circuits. This variant of SOIC is suitable for applications where optimum performance is crucial in IC packaging that has tightened lead pitch.
Asides from the compactness TSSOP package offers, this package option provides enhanced heat dissipation when compared to SSOP. Furthermore, TSSOP offers excellent electrical performance due to the close spacing between the leads and the IC die. Therefore, this enables reduced parasitic and shorter signal paths.
This IC package offers a significant reduction in terms of size while providing low-cost and value-added solutions for various applications. The gull-wing leads of SSOP are extending from its longer sides. TSSOP provides a wide range of benefits which include increased reliability when used in electronic devices.
Both TSSOP and SSOP packaging are popular IC package options for different applications in the electronics industry.
What are the Applications of TSSOP?
TSSOP is an alternative option when SSOP is not suitable. The thin shrink small outline package is widely integrated in various electronic devices. Due to its compactness and excellent electrical performance, it has become a popular IC package option among electronics manufacturers.
TSSOP package is commonly used in microcontrollers. Microcontrollers are used in various devices like medical equipment and industrial machines. Since TSSOP is very thin, it is ideal for microcontrollers. Also, this package is great for various electronic devices like power management ICs and memory modules. Since these devices need great functionality and high level of performance within a limited space, you can consider TSSOP package.
Over time, TSSOP has found its use in several electronic applications. Also, you can find this packaging in different markets and industries like consumer electronics, automotive, and telecommunications among others.
Other SMT Packages
Asides from SOIC packages, there are also other SMT packages. These days, there are various surface mount IC packages. You need a custom PCB to work with these packages. This PCB must have a matching pattern of copper for soldering. Below are some SMT IC packages.
Quad flat packages
A quad flat package has IC pins in all its four directions. These pins are about 8 per each side of the package. The pins of this package have a spacing from about 0.4mm to 1mm. There are smaller variants of the quad flat package. This include low-profile packages (LQFP), thin quad flat package (TQFP), and very thin quad flat package (VTQFP).
Quad flat no-leads (QFN) package
You can achieve a quad-flat no leads (QFN) package if the legs of a QFP are sanded off. QFN packages have tiny connections and there are exposed pads. Sometimes these pads are exposed on the bottom and both sides. The other package exposes the pad on the chip’s bottom. Also, the QFN package has smaller variants which are TQFN, micro lead (MLF), and VQFN. There are thin-dual no-lead (TDFN) packages and dual no-lead (DFN) packages.
Conclusion
SOIC packaging has several variants which include TSSOP, SOIC, MSOP, and SOJ. We have discussed SOIC and TSSOP in this article. These IC packages are some of the most popular IC package options. SOIC packaging and its variants integrate the surface mount technology to package ICs. These IC packaging options offers unique benefits.
Due to the benefits of these IC packages, they are considered a great option for various electronic devices. Also, they are used in different industries like telecommunications and automotive.
