18. Min IC Pitch :0.2mm
19. solder paster printer:0.2mm
20.POP Manufacturing capability: POP *3F
SMT Capability
Long known as electronic manufacturing industry pioneers, we continue that reputation by offering full in-house PCB manufacturing and quickturn/small quantity assembly capabilities.
SMT Assembly Capabilities
Pls Send your PCB File and Bom List to Sales@raypcb.com for quote,Partial or full pcb assembly is welcome.
SMT CAPACITY : 4 MILLION POINTS PER DAY,
| Item | Capability | |
| 1 | Single and double sided SMT/PTH | Yes |
| 2 | Large parts on both sides, BGA on both sides | Yes |
| 3 | Smallest Chips size | 0201 |
| 4 | Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 |
| 5 | Min Leaded parts pitch | 0.008 in. (0.2 mm) |
| 6 | Max Parts size assembly by machine | 2.2 in. x 2.2 in. x 0.6 in. |
| 7 | Assembly surface mount connectors | Yes |
| 8 | Odd form parts: LED Resistor and capacitor networks Electrolytic capacitors Variable resistors and capacitors (pots) Sockets | Yes |
| 9 | Wave soldering | Yes |
| 10 | Max PCB size | 14.5 in. x 19.5 in. |
| 11 | Min PCB Thickness | 0.02 |
| 12 | Fiducial Marks | Preferred but not required |
| 13 | PCB Finish: | 1．SMOBC/HASL 2．Electrolytic gold 3．Electroless gold 4．Electroless silver 5．Immersion gold 6．Immersion tin 7．OSP |
| 14 | PCB Shape | Any |
| 15 | Panelized PCB | 1．Tab routed 2．Breakaway tabs 3．V-Scored 4．Routed+ V scored |
| 16 | Inspection | 1．X-ray analysis 2．Microscope to 20X |
| 17 | Rework | 1．BGA removal and replacement station 2．SMT IR rework station 3．Thru-hole rework station |