Board Type: Aluminum Substrate PCB
Board layer: single layer PCB
Board thickness: 0.6mm
Surface treatment: OSP
Mechanical Rigidity:Flexible
Substrate:Aluminum
Insulation:Organic resin
Insulation Layer Thickness:Regular Board
Flame Retardant Characteristics:VO Board
Processing Technology:Calendered Foil
Reinforcement:Glass Fiber Cloth Base
Insulation Resin:Epoxy Resin(EP)
Applicable Products Lighting
0.6MM thick calendered copper bending aluminum substrate is a kind of heat dissipation material used for high thermal conductivity and high pressure resistance LED lighting equipment, which is made of aluminum substrate and calendered copper bending. This aluminum substrate has the advantages of high thermal conductivity, high pressure resistance, easy processing, easy bending, etc., and can meet the needs of various complex shapes of LED lighting equipment.
The production process of 0.6MM thick calendered copper bending aluminum substrate includes opening, drilling, calendered copper bending, line imaging, etching, silkscreen solder resist, silkscreen characters, surface treatment and other steps. In the production process, strict quality control is required to ensure that the flatness, thermal conductivity and electrical properties of the aluminum substrate meet the requirements.
0.6MM thick calendered copper bending aluminum substrate has a wide range of applications, including LED street lights, LED floodlights, LED industrial and mining lights and other lighting equipment.
0.6MM thick calendered copper bending aluminum substrate is an efficient, reliable and economical LED heat dissipation solution for all kinds of LED lighting equipments that require efficient heat dissipation.
