Layers: 14 Layer PCB
PCB thickness: 1.6±0.05mm
Material: IT170GRA1TC
Minimum Mechanical hole: 0.2mm
Minimum line width/spacing 75/75um
Aperture ratio 8:1
Surface Finished: Immersion gold, thickness: 0.05um + gold finger thickness 15u”
What is 14-layer high-speed computer gold finger plug-in PCB ?
The 14-layer high-speed computer gold finger plug-in PCB board is a multilayer PCB board designed for high-speed data transmission, which is mainly used for expansion cards in computers and other electronic devices, such as graphics cards, network cards, sound cards and so on. Its features and applications are as follows:
1. **14-layer design**: It means that the PCB board consists of 14 independent conductive copper layers separated by a dielectric layer. This design allows for higher wiring density, meets the layout requirements of high-speed signal transmission lines, effectively reduces signal crosstalk, and improves signal integrity and power integrity.
2. **High-speed transmission**: These boards are usually used to handle high-speed signals, such as PCIe, SATA, USB 3.x and other high-speed interface specifications, with low signal loss and delay characteristics, to ensure efficient and stable data transmission.
3. **Gold Finger (Gold Finger)**: refers to one or more rows of gold-plated contacts on the edge of the board, used to insert the motherboard or other equipment into the corresponding slot, to realize the physical connection and electrical signal transmission. The gold material has excellent electrical conductivity and oxidation resistance, ensuring the stability and durability of the connection.
4. **Application Fields**: Mainly used in all kinds of high-performance computer systems, servers, workstations, embedded systems, communication equipment, etc., as a key component for hardware upgrading or function expansion.
5. **Design Challenges**: Signal integrity, power integrity, electromagnetic compatibility (EMC) and other issues need to be considered when designing such boards, often requiring the use of differential pair wiring, termination techniques, shielding measures and other means to optimize signal quality.
