Layer: 4 Layer copper base
Plate thickness: 5.6mm
Minimum hole : 0.35mm
Minimum line width/spacing: 1.25mm
Inner layer copper thickness: 1oz
Outer layer copper thickness: 1oz
Finish: Gold plating ENIG
Minimum distance from hole to line: 0.185mm
What is 4 Layer Copper Substrate PCB ?
4-layer gold plated copper substrate is a multilayer high frequency PCB board with the following advantages:
High thermal conductivity: Copper substrate has high thermal conductivity, which can conduct heat quickly and improve the efficiency of thermoelectric conversion.
High electrical conductivity: Copper substrate has high electrical conductivity, which can conduct electrons quickly and improve the generation of thermoelectric effect and current output.
Good mechanical properties: copper substrate has high strength and hardness, corrosion resistance is also good, can be adapted to a variety of environmental application needs.
Good processing performance: copper substrate is easy to cut and molding, can be prepared into a variety of shapes and sizes of devices, suitable for a variety of applications.
High reliability: Copper substrate adopts high-quality materials and manufacturing process, with high reliability and stability.
Gold plating: The surface of copper substrate is treated with gold plating, which can provide better signal transmission performance and stability.
The 4-layer goldized copper substrate is a high-performance, high-stability and reliable PCB board for high-end electronic products that require high thermal conductivity, high conductivity, high reliability, good processing performance and signal transmission performance.
