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High Speed High Frequency PCB Manufacturing

Dedicated To High Complex PCB: High DK, Blind cross buried, Rigid-Flex, extreme copper PCB

PCB Manufacturing & Assembly Services

About Us

18 Years PCB Manufacturer

RAYMING PCB is providing the latest printed circuit board manufacturing technologies and highest quality standards for electronics industry. You can count on RAYMING to meet your needs. Pursuing technological leadership is the unchanging belief of RAYMING, and striving to build an innovation Lab and engineers Team to overcome new design challenges: High Speed and High Capacity, RF and Microwave, Thermal Management, Miniaturization, Chip package substrate.

We provide RF and Microwave Solution, High Speed and High Capacity, Thermal Management Solutions to 5G, AI Robotics, BMS… , our Technical ability: Mechanical Blind holes Backplane, 100 layers dobolue-side Crimping Backplane, Multifunctional integrated Copper Combined board, ODU RF Board, E-band ODU RF Board, BMS FPC Board, FPC Of car`s camera, Ultrasonic probe FPC Board, SSD FPC Board, Welcome to send high complext RFQs to estimate Cost .

Latest PCB Manufacturing Projects


optical module PCB

Medical PCB

Rogers 4350B + Copper Base PCB

Hybrid PCB: Rogers 4350B + Copper Base PCB

32 layer PCB

32 Layer PCB Manufacturing with 6.5mm thickness, Motor EPC Application

Ceramic PCB

Ceramic PCB manufacturing with Step holes + bevelled edges process

Radar RF PCB

8 Layer 77 GHz millimeter wave radar, Material: Ro3000+IT180A

14 layer SSD PCB

14 Layer High TG FR4+ PI, 4 Step HDI PCB

E-band ODU RF Board

4 Layer 1oz E-band ODU RO4350+FR4 Hybrid PCB

Flexible PCB

2 Layer Flex PCB with PI & FR4 stiffener

Rogers 4350b pcb

Rogers 4350B PCB manufacturing, 0.8mm thickness

Rigid Flex PCB

6 Layer Rigid PCB , 2 Layer Flex PCB

PCB We Served

PCB Manufacturing Capability

SpecificationsStandard SpecsCustom Specs
Layer Count1 - 68 Layers100 Layers
Turn Time Same Day - 5 Day Same Day - 4 Weeks
Max. Size (Finish Size) 600*770mm( 23.62″*30.31″)Line-card: 850mmX570mm Backplane: 1320mmX600mm
Drill Hole Diameter0.3mmMechanical: ≥0.15mm(6mil) Laser: 0.1mm(4mil)
MaterialsFR-4 1. High Speed: Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 2. High Frequency: Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 3. others: Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,
Plate FinishLead-Free HAL*Electrolytic Hard Gold / Soft Gold / ENIG / ENEIPIG/ Nickel / Immersion Silver / Leaded & Lead-Free HAL
Cert. / QualificationsIPC Class 2 - A600 IPC6012 Class 2-3A / IPC6012 Class 3 DS/IPC6018 Class 3 MIL-PRF-31032 / MIL-PRF-55110 / ISO 9001:2008 / AS9100D / Others
Board Thickness.031" / .062" / .093" / .125"Max 10mm(394mil)Sample 14mm(551mil)
Copper Weight1 oz. Inner / Up to 2 oz. Outer 0.5 - 4 oz. Inner / 1-30 oz. Outer
Aspect Ratio (Finish Hole)10: 1Line-card: 20:1 Backplane: 25:1
Trace / Space4 / 4 MilsDown to 2.2mil/2.2mil