Dupont PCB ( Any Dupont PCB Enquiry Pls send mail to Sales@raypcb.com )
Electronics materials from a company with a deep understanding of materials science a commitment to technology leadership, a wide range of process expertise and a long history of innovation. DuPont offers the industry’s broadest array of high performance electronic materials. The portfolio includes materials for rigid and flexible circuits including: Kapton®, Pyralux®, Interra® and other advanced laminates.
Dupont HT
RayPCB is a leader in design and fabrication of HIGH TEMPERATURE APPLICATION FLEX CIRCUITS for use in industries such as Oil & Gas Exploration (“down hole”), Medical Instrument Sterilization (“autoclave survivability”); Engine Controls (“under hood”) and Automotive Brakes and Transmissions as well as many defense (aircraft, missile and vehicles) and space exploration applications.
RayPCB employs methodically developed process techniques along with DuPont’s new HT materials – copper clad laminate, coverlay and bondply – to fabricate state-of-the-art Flex Circuits which can operate at temperatures in excess of 250°C. The DuPont all-polyimide Pyralux HT material system have the highest temperature operating rating of any flex circuit material and provided with the long-standing quality and consistency that the industry has come value and expect from DuPont.
This proven interconnect solution gives the designer more options in solving electronic packaging challenges. With the ability to incorporate Flex Circuit and enjoy – in a high heat environment – the benefits of these three dimensional internconnects. Contact Rayming PCB Manufacturer for immediate discussion with an engineer to determine if this technology is right for your application.
“HT”, “Pyralux” and DuPont” are trademarks or registered trademarks of E. I. du Pont de Nemours and Company or its affiliates.
Dupont HT Datasheet
Dupont HT Datasheet
Dupont HT
Laminate Materials
Copper Clad Laminants
Pyralux® AC copper-clad laminate
Pyralux® AP copper-clad laminate
Pyralux® AP-PLUS all-polyimide thick copper-clad laminate
Pyralux® APR copper-clad resistor laminate
Pyralux® LF Copper-clad Laminate
Pyralux® FR copper-clad Laminate
Pyralux® TK flexible circuit material
Coverlay, Bondply & Sheet Adhesive
Pyralux® FR coverlay
Pyralux® FR bondply
Pyralux® FR sheet adhesive
Pyralux® LF coverlay
Pyralux® LF bondply
Pyralux® LF adhesive
Pyralux® LG Glass Reinforced Bonding Film
Pyralux® PC Photoimageable Coverlay
Except Dupont PCB, RayMing also offer Nelco PCB,Isola PCB, Arlon PCB manufacturing.
Dupont Pyralux series material
1. FR series has halogen bonding sheet (abbreviated as pure glue)
| Product number | Glue thickness mil(um) | Packing specification | Application field |
| FR0100 | 1（25） | 24in(W)*250ft 250mm*100m | FPC multilayer board, rigid board and soft-hard combined board interlayer composite |
| FR0200 | 1（51） | ||
| FR0300 | 1（76） | ||
| FR0400 | 4(102) | ||
| FR1500 | 1/2(13) | ||
| FR1501 | 0.7（18） |
2. LF series halogen-free adhesive sheet (abbreviated as pure glue)
| Product number | Glue thickness mil(um) | Packing specification | Application field |
| LF0100 | 1（25） | 24in(W)*250ft 250mm*100m | FPC multilayer board, rigid board and soft-hard combined board interlayer composite |
| LF0200 | 1（51） | ||
| LF0300 | 1（76） | ||
| LF0400 | 4(102) | ||
| LF1500 | 1/2(13) | ||
| LF1501 | 0.7（18） |
3.HXC series black cover film Coverlay
| Product number | Adhesive ADH thickness mil(um) | PI thickness (um) | Packing specification | Application field |
| HXC1215 | 0.6(15) | 12 | 249mm*200m 500mm*200m | The black epoxy type epoxy cover film designated by the Apple project has a shelf life of 4 months |
| HXC1220 | 0.8(20) | 12 | ||
| HXC1225 | 1(25) | 12 | ||
| HXC2525 | 1(25) | 25 |
4. FR series yellow cover film Coverlay (containing halogen)
| Product number | Adhesive ADH thickness mil(um) | PI thickness (um) | Packing specification | Application field |
| FR0110 | 1(25) | 25 | 24in(610mm)* 250ft(76m) | The general industrial yellow cover film has a higher flame retardant rating than the halogen-free LF series. |
| FR0120 | 1(25) | 51 | ||
| FR7001 | 1/2(13) | 13 | ||
| FR7013 | 1(25) | 13 |
5.LF series yellow cover film Coverlay (halogen free)
| Product number | Adhesive ADH thickness mil(um) | PI thickness (um) | Packing specification | Application field |
| LF0110 | 1(25) | 25 | 24in(610mm)* 250ft(76m) 250mm*100m | Optical and industrial halogen-free yellow cover film, normal working temperature can reach 140°C |
| LF0120 | 1(25) | 51 | ||
| LF7001 | 1/2(13) | 13 | ||
| LF7013 | 1(25) | 13 |
6. FR series Bondply (referred to as PI with glue on both sides, containing halogen)
| Product number | Adhesive ADH thickness mil(um) | PI thickness (um) | Packing specification | Application field |
| FR0111 | 1(25) | 25 | 24in(610mm)* 250ft(76m) | |
| FR0121 | 1(25) | 51 | ||
| FR0131 | 1(25) | 76 | ||
| FR0212 | 2（51） | 25 | ||
| FR7021 | 1/2（13） | 1/2（13） | ||
| FR7016 | 1(25) | 1/2（13） | ||
| FR7081 | 2（51） | 1/2（13） | ||
| FR1515 | 1/2（13） | 25 |
Application Field: Double-sided adhesive PI, Acrylic adhesive system, sealed and preserved at room temperature, applied to the inner layer of multi-layer boards and the inner layer of flexible and rigid boards, especially for the inner layer 2+2 structure, the laminated structure with etched lines on both sides, good Filling performance, optimizing the structure, while reducing the number of pressing
7.LF series Bondply (referred to as PI with glue on both sides, halogen-free)
| Model | Adhesive ADH Thickness mil(um) | PI（um） | Packages | Application Field |
| LF0111 | 1(25) | 25 | 24in(610mm)* | |
| LF0121 | 1(25) | 51 | ||
| LF0131 | 1(25) | 76 | ||
| LF0212 | 2（51） | 25 | ||
| LF7021 | 1/2（13） | 1/2（13） | ||
| LF7016 | 1(25) | 1/2（13） | ||
| LF7081 | 2（51） | 1/2（13） | ||
| LF1515 | 1/2（13） | 25 |
Application Field: Double-sided adhesive PI, Acrylic adhesive system, sealed and preserved at room temperature, applied to the inner layer of multi-layer boards and the inner layer of flexible and rigid boards, especially for the inner layer 2+2 structure, the laminated structure with etched lines on both sides, good Filling performance, optimizing the structure, while reducing the number of pressing
8. HXN series ultra-thin yellow cover film Coverlay (epoxy type)
| Model | Adhesive ADH Thickness mil(um) | PI（um） | Packages | Application Field |
| HXN0510 | 0.4（10） | 5 | 250mm*200m 500mm*200m | Epoxy type ultra-thin cover film, special for LCM module, good flexibility |
| HXN0515 | 0.6(15) | 5 | ||
| HXN0810 | 0.4（10） | 8 | ||
| HXN0815 | 0.6(15) | 8 |
Adhesive base FR (halogen)\LF (halogen free)
1.FR series single-sided plastic substrate (containing halogen)
| Model | Cu OZ/ft2(um) | Adhesive （um） | PI（um） | Package | Application Field |
| FR9110R | 1(35) | 25 | 25 | 24in(610 mm)* | The industrial type has a plastic substrate on one side, and the normal working temperature can reach 140°C. It is mainly used in industrial, photoelectric, automotive, and medical |
| FR9120R | 1(35) | 25 | 51 | 36in(914 mm) | |
| FR9130R | 1(35) | 25 | 76 | ||
| FR9150R | 1(35) | 25 | 127 |
2. FR series double-sided adhesive substrate (containing halogen)
| Model | Cu OZ/ft2(um) | Adhesive （um） | PI（um） | Package | Application Field |
| FR9111R | 1(35) | 25 | 25 | 24in(610 mm)* 36in(914 mm) | |
| FR9121R | 1(35) | 25 | 52 | ||
| FR9131R | 1(35) | 25 | 76 | ||
| FR9222R | 2(70) | 25 | 127 |
Application Field: Double-sided adhesive substrate, working temperature up to 140°C, mainly used in industrial, optoelectronic, automotive, medical and aerospace
3.LF series single-sided plastic substrate (halogen-free)
| Model | Cu OZ/ft2(um) | Adhesive （um） | PI（um） | Package | Application Field |
| LF9110R | 1(35) | 25 | 25 | 24in(610 mm)* 36in(914 mm) | |
| LF9120R | 1(35) | 25 | 51 | ||
| LF9130R | 1(35) | 25 | 76 | ||
| LF9150R | 1(35) | 25 | 51 |
Application field: The industrial type has a plastic substrate on one side, and the normal working temperature can reach 140°C. It is mainly used in industrial, photoelectric, automotive, and medical
4.LF series double-sided adhesive substrate (halogen-free)
| Model | Cu OZ/ft2(um) | Adhesive （um） | PI（um） | Package | Application Field |
| LF9111R | 1(35) | 25 | 25 | 24in(610 mm)* 36in(914 mm) | |
| LF9121R | 1(35) | 25 | 51 | ||
| LF9131R | 1(35) | 25 | 76 | ||
| LF9222R | 2(70) | 25 | 51 |
Application Field: The industrial type has a plastic substrate on one side, and the normal working temperature can reach 140°C. It is mainly used in industrial, photoelectric, automotive, and medical
5.Glue-free substrate
| Model | Cu OZ/ft2(um) | Adhesive （um） | Cu OZ/ft2(um) | Package | Application Field |
| AC121200EM/R | 12(1/3) | 12 | 12(1/3) | 250mm*100m 500mm*100m | |
| AC122000EM/R | 12(1/3) | 20 | 12(1/3) | ||
| AC182000EM/R | 18(1/2) | 20 | 18(1/2) | ||
| AC182500EM/R | 18(1/2) | 25 | 18(1/2) | ||
| AC181200EM/R | 18(1/2) | 12 | 18(1/2) | ||
| AC352500EY/R | 35(1.0) | 25 | 35(1.0) | ||
| AC354500EY/R | 35(1.0) | 45 | 35(1.0) |
Application Field: Single-sided non-adhesive substrate for consumer electronics, applied to ordinary single-sided and multi-layer soft boards
6.AK series double-sided adhesive-free substrate (HTE copper)
| Model | Cu OZ/ft2(um) | Adhesive （um） | Cu OZ/ft2(um) | Package | Application Field |
| AK121212EM | 12(1/3) | 12 | 12(1/3) | 500mm*100m | |
| AK121812EM | 12(1/3) | 18 | 12(1/3) | ||
| AK122512EM | 12(1/3) | 25 | 12(1/3) | ||
| AK125012EM | 18(1/2) | 50 | 18(1/2) | ||
| AK182518EM | 18(1/2) | 25 | 18(1/2) | ||
| AK185018EM | 18(1/2) | 50 | 18(1/2) |
Application Field: Double-sided adhesive-free substrate for consumer electronics, high ductility electrolytic copper, applied to the inner layer of ordinary double-sided boards and rigid-flex board, with good expansion and shrinkage stability
7.AK series double-sided adhesive-free substrate (HA copper)
| Model | Cu OZ/ft2(um) | Adhesive （um） | Cu OZ/ft2(um) | Package | Application Field |
| AK122512RY | 12(1/3) | 25 | 12(1/3) | 250mm*100m 500mm*100m | |
| AK182518RY | 18(1/2) | 25 | 18(1/2) | ||
| AK185018RY | 18(1/3) | 50 | 18(1/2) |
Application Field: Double-sided adhesive-free substrate for consumer electronics, HA high ductility rolled copper, applied to the inner layer of ordinary double-sided boards and rigid-flex board, with good bending performance
8.KP series double-sided adhesive-free substrate
| Model | Cu OZ/ft2(um) | Adhesive （um） | Cu OZ/ft2(um) | Package | Application Field |
| KP122512E | 12(1/3) | 25 | 12(1/3) | 250mm*100m | |
| 500mm*100m | |||||
| KP182518E | 18(1/2) | 25 | 18(1/2) | 250mm*100m | |
| 500mm*100m |
Application Field: LCD, LCM, TP, camera module and consumer electronics application substrate, good expansion and contraction stability, within 3%% after heat treatment in TD direction, and within 5%% in MD.
9. AP series double-sided adhesive-free substrate
| Model | Cu OZ/ft2(um) | Adhesive （um） | Cu OZ/ft2(um) | Package | Application Field |
| AP8515R | 18(1/2) | 25 | 18(1/2) | 24in(610mm)* | |
| 36in(914mm) | |||||
| AP8525R | 18(1/2) | 51 | 18(1/2) | 24in(610 mm)* | |
| 18in(457mm) | |||||
| AP9111R | 1(35) | 25 | 1(35) | 24in(610mm)* | |
| 12in(305mm) | |||||
| AP9121R | 1(35) | 51 | 1(35) | 12in(610mm)* | |
| AP9131R | 1(35) | 76 | 1(35) | 18in(457mm) |
Application Field: Industrial double-sided non-adhesive substrate, normal working temperature can reach 180°C, transmission speed can reach about 10GHZ, mainly used in industrial, photoelectric module, automobile, medical, aerospace
10.Pyralux® JT Coverfilm and Bonding Material
| Model | PI（um） | Material characteristics | Package |
| JT25 | 25 | Polyamideimide material, normal working temperature can reach 150° | 24in(W)*250ft |
| JT50 | 50 |
11. Pyralux® HT Coverfilm and Bonding Material
| Model | PI（um） | Material characteristics | Package |
| HT0100 | 25 | The normal working temperature can be resistant to 225°; high temperature press is required for pressing, and the temperature is above 300° | 24in(W)*250ft |
| HT7049 | 38 | ||
| HT0200 | 50 | ||
| HT0300 | 75 |
12. HT series industrial high temperature resistant substrate
| Model | Cu OZ/ft2(um) | Adhesive （um） | Cu OZ/ft2(um) | Package | Application Field |
| HT8515R | 18(1/2) | 25 | 18(1/2) | 24in(610mm)* | |
| 36in(914mm) | |||||
| HT8525R | 18(1/2) | 51 | 18(1/2) | 24in(610mm)* | |
| 18in(457mm) | |||||
| HT9111R | 1(35) | 25 | 1(35) | 24in(610mm)* | |
| 12in(305mm) | |||||
| HT9121R | 1(35) | 51 | 1(35) | 12in(610mm)* | |
| 18in(457mm) |
Application Field: Full polyimide series double-sided adhesive-free substrate, the soft board material with the highest temperature resistance today, working temperature can reach above 225°C, high bonding force, excellent insulating layer thickness uniformity and electrical properties
